System in Package Market, Trend and Forecast, 2015 – 2024

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System in package (SiP) is a module where numbers of integrated circuits are enclosed. It is typically used inside a mobile phone, digital music player, etc. to perform several functions of an electronic system.

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System in Package Market Global Scenario, Market Size, Outlook, Trend and Forecast, 2015 – 2024:

System in Package Market Global Scenario, Market Size, Outlook, Trend and Forecast, 2015 – 2024 Variant Market Research | [email protected] 1 Bhavana Patel SEO Analyst [email protected]

Description - System in Package Market:

Description - System in Package Market System in package ( SiP ) is a module where numbers of integrated circuits are enclosed.  It is typically used inside a mobile phone, digital music player, etc. to perform several functions of an electronic system. Higher functionality at minimum production costs and the growing demand for smaller electronics and mechanical devices has headed to the development of System in Package ( SiP ) solutions. SiP can be recognized by the horizontal tiling or vertical stacking of more than one related or unrelated bare die or packaged chips. To Know More About This Report, Visit Here: http://bit.ly/2rFV8DD Variant Market Research | [email protected] 2

System in Package Market:

System in Package Market Variant Market Research | [email protected] 3

System in Package Market:

System in Package Market Major driving factors for this market are emergence of advanced and compact consumer electronic devices and conventional packaging cost of ICs like, packaging with the variation of sizes of the ICs. However, limited availability of resource & skills is hampering the growth of the market. Growing demand of high performance electronic devices is creating future opportunities for the system in package market. Variant Market Research | [email protected] 4

Top Manufactures:

Top Manufactures Jiangsu Changjiang Electronics Tech Co, United Test and Assembly Center Ltd, Automotive Service Excellence, Siliconware Precision Industries, Amkor Technology, ChipSiP Technology, ChipMOS Technology, NANIUM, S.A, Samsung Electro-Mechanics, Octavo Systems among others. Variant Market Research | [email protected] 5

Scope of System in Package Market:

Scope of System in Package Market Packaging Technology Segments 2D 2.5D 3D Interconnection Technology Segments Flip chip Wire bond Variant Market Research | [email protected] 6

Scope of System in Package Market:

Scope of System in Package Market Type Segments Surface mount technology (SMT) Quad flat package (QFP) Ball grid array (BGA) Small outline package (SOP) Application Segments Communications Medical Automotive Consumer electronics Others Variant Market Research | [email protected] 7

Scope of System in Package Market:

Scope of System in Package Market Geographical Segments North America US Canada Mexico Europe Germany France United Kingdom Spain Others Variant Market Research | [email protected] 8

Scope of System in Package Market:

Scope of System in Package Market Geographical Segments Asia-Pacific China India Japan South Korea Others RoW South America Middle East Africa Variant Market Research | [email protected] 9

Contact Us:

Contact Us VARIANT MARKET RESEARCH LLP Web:  https://www.variantmarketresearch.com USA Office: 649 Mission St., 5th Floor, San Francisco, CA 94105, United States. Tel: +1-415-680-2785 Fax: +1-415-680-2786 Email:  [email protected] Or [email protected] variantmarketresearch.com India Office (Corporate Headquarter): Office No. FL No.7, Prakash Developers, Survey no 34/A5, Wadgaon Sheri, Nagar Road, Pune – 411014 Tel: +91 20 65337795 Variant Market Research | [email protected] 10

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