BGA Layout While Designing Your Printed Circuit Board

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Presentation Description

As technology increases, so does the need for BGA (Ball Grid Array) components. Screaming Circuits is excited to offer a presentation on BGA layout. This topic will cover why to use BGA's and specific considerations to have while designing your pcb.

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Presentation Transcript

BGA Layout:

BGA Layout Presenter Mike Galloway Manufacturing Engineer for ease of use

Overview :

Overview Introduction BGA Capability BGA History DFM Standards Technologies Design Thermal Management Trace Routing and Vias

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Introduction Mike Galloway’s Experience: 18 years in electronics manufacturing. Technical Support Team Manager for Screaming Circuits. Screaming Circuits History: Established in 2003. Assemble tens of thousands of boards with BGA components a year. Screaming Circuits and it’s parent company MEC share 50 years of PCB assembly experience.

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BGA Experience Micro BGA: Less than .5mm Package on Package: Two BGA’s stacked. Hybrid Process Mixed Alloys Solder Paste: Solder Jet Printing Standard Stencil Paste Application www.mydata.com Fig. 3 Fig. 4 www.laocsmta.org Fig. 5 Fig. 6

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BGA History Developed in late 1980’s , gained popularity in 1990’s, and wide spread use in 2000’s. More complicated IC’s mean more I/O . Real estate is at a premium, therefore smaller package types are becoming more common . .5mm pitch and smaller is being used more. Package on Package (POP) gaining popularity. Extensive use in the mobile device market .

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Standards IPC-7095B Design and Assembly Process Implementation for BGAs IPC- 7351A Land pattern standard IPC-A-610E Acceptability of Electronic Assemblies IPC-J-STD-001E Requirements for Soldered Electrical and Electronic Assemblies http://www.ipc.org Recommended reads:

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Technologies Mixed Technology: Lead free BGA and leaded solder. Some good history in the industry. Alloy seems to be somewhat reliable for commercial applications. Leaded BGA and lead free solder. ( Not recommended) Voiding. Alloy issues. Part integrity compromised due to heat. Ball Alloy and its effect on assembly. Avoid mixing if possible. Stick with what is reliable and easy. www.jovy-sys.com Fig. 10

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Designs Micro BGAs and the challenges around them: Larger dense parts nearby. Issues with profiling. Small pads. SMDP (Solder Mask Defined Pad) Trace routing: Via in pad. (Fig. 12) www.polarinstruments.com Fig. 11 Fig. 12

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Package on Package (POP ): Limited experience in prototypes. Requires significant process development. Things to consider while designing: Adjacent Components PCB Stack up Process development : Part warping causing defects or long term reliability issues. Designs

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HASL - Micro BGA not recommended due to coplarinarity variations. ( Fig. 14) ENIG - Needs good plating controls. Most vendors watch this very close. (Fig. 15) IMAg - Some concerns with microvoids . (Fig. 16) Surface Finish Choices Fig. 14 Fig. 15 Fig. 16

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Thermal Management Ground/thermal pad under package: Effects of inner ball reflow. (Fig . 17) Voiding in pad causing insufficient heat transfer. Vias in ground pad leaching solder away from the die and down the vias . (Fig. 18) Fig. 18 Fig. 17

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Trace Routing and Vias Designs that try to keep everything on few layers: Routing between pads. (Fig. 19) Connecting a series of pads. (Fig. 20) Using a thick trace, mask defined pads Oversize or undersize pads, or a combination of both on one BGA Fig. 19 Fig. 20

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Summary Best guide for DFM standards is IPC-7095B . BGA’s are becoming unavoidable and require more knowledge for manufacturability. L earn more, ask questions: Go to SMTA meetings www.ipc.org http://www.element14.com/community/groups/screaming-circuits mgalloway@screamingcircuits.com

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