logging in or signing up Advanced PCB Troubleshooting ryansmta Download Post to : URL : Related Presentations : Share Add to Flag Embed Email Send to Blogs and Networks Add to Channel Uploaded from authorPOINT lite Insert YouTube videos in PowerPont slides with aS Desktop Copy embed code: (To copy code, click on the text box) Embed: URL: Thumbnail: WordPress Embed Customize Embed The presentation is successfully added In Your Favorites. Views: 1044 Category: Science & Tech.. License: All Rights Reserved Like it (1) Dislike it (0) Added: July 09, 2009 This Presentation is Public Favorites: 1 Presentation Description No description available. Comments Posting comment... Premium member Presentation Transcript Advanced PCB Trouble Shooting-The Good, the Bad and the Ugly : Advanced PCB Trouble Shooting-The Good, the Bad and the Ugly Michael Carano OMG Electronic Chemicals Agenda : Agenda Introduction Innerlayer Treatment/MLB fabrication Opens, shorts, delamination Other Lamination/MLB issues Material selection Misregistration PTH -Electroless copper/metalization issues PTH defects-voids, ICD, Hole wall pullaway Electroplating related issues Mouse bites Cosmetic defects Copper defects-barrel cracking, dog-boning Plating distribution and relationship to PCB reliability Final Finish related issues Black Pad Trench etch Champagne Bubble and other Surface finish defects Solderability failures and final finishes General session MATERIAL MOVEMENTPrepreg during/after cure drives the relative positions of the layer images : MATERIAL MOVEMENTPrepreg during/after cure drives the relative positions of the layer images MATERIAL MOVEMENTPrepreg during/after cure drives the relative positions of the layer images : MATERIAL MOVEMENTPrepreg during/after cure drives the relative positions of the layer images More prepreg makes it worse Without proper scaling Drilled hole Voids : Voids Type A and Type B -ICD : Type A and Type B -ICD Blow Holes and Wedge Voids : Blow Holes and Wedge Voids Gas Bubble Pit : Gas Bubble Pit Photo courtesy of DuPont Causes of Micro-Nodules : Causes of Micro-Nodules Micro-nodules are a result of rapid crystal growth in the z-axis during acid copper plating Copper foil imperfections DIFFICULTY FACTOR : DIFFICULTY FACTOR Aspect Ratio Difficulty Factor 10:1 10:1 1 2 Panel Thickness2 _____________________ Hole diameter Direct Cause Mechanism For Microvoids: : Direct Cause Mechanism For Microvoids: ‘Copper Caves’ are small (~1 µm) enclosed cavities in copper lands, under the ImAg plating, in as-received PCBs. ImAg Copper Land Cave PCBs with caves resulted in microvoids, PCBs without caves resulted in no microvoids. Cave is fully enclosed: ImAg forms a ‘roof’ over the cave. 1 µm Walls and floor of cave are oxidized copper. 1 µm ‘Chimney’ SMTAI 2009San Diego, CA : SMTAI 2009San Diego, CA You do not have the permission to view this presentation. In order to view it, please contact the author of the presentation.
Advanced PCB Troubleshooting ryansmta Download Post to : URL : Related Presentations : Share Add to Flag Embed Email Send to Blogs and Networks Add to Channel Uploaded from authorPOINT lite Insert YouTube videos in PowerPont slides with aS Desktop Copy embed code: (To copy code, click on the text box) Embed: URL: Thumbnail: WordPress Embed Customize Embed The presentation is successfully added In Your Favorites. Views: 1044 Category: Science & Tech.. License: All Rights Reserved Like it (1) Dislike it (0) Added: July 09, 2009 This Presentation is Public Favorites: 1 Presentation Description No description available. Comments Posting comment... Premium member Presentation Transcript Advanced PCB Trouble Shooting-The Good, the Bad and the Ugly : Advanced PCB Trouble Shooting-The Good, the Bad and the Ugly Michael Carano OMG Electronic Chemicals Agenda : Agenda Introduction Innerlayer Treatment/MLB fabrication Opens, shorts, delamination Other Lamination/MLB issues Material selection Misregistration PTH -Electroless copper/metalization issues PTH defects-voids, ICD, Hole wall pullaway Electroplating related issues Mouse bites Cosmetic defects Copper defects-barrel cracking, dog-boning Plating distribution and relationship to PCB reliability Final Finish related issues Black Pad Trench etch Champagne Bubble and other Surface finish defects Solderability failures and final finishes General session MATERIAL MOVEMENTPrepreg during/after cure drives the relative positions of the layer images : MATERIAL MOVEMENTPrepreg during/after cure drives the relative positions of the layer images MATERIAL MOVEMENTPrepreg during/after cure drives the relative positions of the layer images : MATERIAL MOVEMENTPrepreg during/after cure drives the relative positions of the layer images More prepreg makes it worse Without proper scaling Drilled hole Voids : Voids Type A and Type B -ICD : Type A and Type B -ICD Blow Holes and Wedge Voids : Blow Holes and Wedge Voids Gas Bubble Pit : Gas Bubble Pit Photo courtesy of DuPont Causes of Micro-Nodules : Causes of Micro-Nodules Micro-nodules are a result of rapid crystal growth in the z-axis during acid copper plating Copper foil imperfections DIFFICULTY FACTOR : DIFFICULTY FACTOR Aspect Ratio Difficulty Factor 10:1 10:1 1 2 Panel Thickness2 _____________________ Hole diameter Direct Cause Mechanism For Microvoids: : Direct Cause Mechanism For Microvoids: ‘Copper Caves’ are small (~1 µm) enclosed cavities in copper lands, under the ImAg plating, in as-received PCBs. ImAg Copper Land Cave PCBs with caves resulted in microvoids, PCBs without caves resulted in no microvoids. Cave is fully enclosed: ImAg forms a ‘roof’ over the cave. 1 µm Walls and floor of cave are oxidized copper. 1 µm ‘Chimney’ SMTAI 2009San Diego, CA : SMTAI 2009San Diego, CA