Advanced Packaging… Who Cares? :
Advanced Packaging… Who Cares? Everyone in the global electronic industry is significantly impacted by decisions routinely made by the electronic packaging community. Nowhere is that impact more deeply felt than in the realm of surface mount technology
The simple truth is that IC packaging has long lead the march of interconnection technology and it will likely continue to do so in the foreseeable future
We are now in the midst of significant change, where once bright lines between the different levels of the electronic interconnection hierarchy are blurring. With that change comes both challenge and opportunity
Some time based perspective helps to appreciate this change and perhaps help us chart a successful course
The Evolution of Electronic Assembly :
The Evolution of Electronic Assembly ~1940 2009 ?
Workshop Topics :
Workshop Topics Role of IC packaging technologies in electronics assembly
Construction & manufacturing processes for common IC packages
Impact of IC package design on the assembly processes
Chip scale and Wafer Level packaging types
Reliability testing & electrical performance of CSPs
The continuing impact of lead-free & alternative approaches
Interconnection substrate challenges and solutions
IC testing structures and strategies
New and evolving 3-D packaging concepts (JISSO)
What’s new, & where IC packaging technology is headed
Trends in the integration of the IC, the package & PCB substrate
The future of IC packaging and interconnections
Where and When? :
Where and When? The Town and Country Resort and Convention Center San Diego, CA Sunday, October 4, 20091:30pm – 5:00pm