3dic ppt

3-DIMENSIONAL INTEGRATED CIRCUITS: 

3-DIMENSIONAL INTEGRATED CIRCUITS By B.S.V.Phanindra-2 nd btech,ece-49

OUTLINE:: 

OUTLINE: Introduction 3D IC

What is a 3D IC?: 

What is a 3D IC? “Stacked” 2D (Conventional) ICs Could be Heterogeneous…

why 3D:: 

why 3D: Reduces chip area Performance and energy efficient A scalable solution to multiple-core-on-chip design © PSU

Why 3D? … It Reduces Chip Area: 

Why 3D? … It Reduces Chip Area Chip stacking brings neighboring circuits closer by exploiting routing in third dimension. As a result the chip area decreases. © PSU

Why 3D? … It Reduces Communication Related Delay and Power: 

Why 3D? … It Reduces Communication Related Delay and Power Interconnect will occupy a major portion of chip delay and power in future. 3D ICs reduces wire length, thus cutting down wire delay and power. Processor design and individual core component design in 3D (This work) highlights the above mentioned trends of 3D design . Intel Corporation, SLIP’04 System power breakdown

Why 3D? … More Cores Can be Fabricated on a Chip with Dense Layout Offered by 3D ICs: 

Why 3D? … More Cores Can be Fabricated on a Chip with Dense Layout Offered by 3D ICs Chip multiprocessors are becoming common these days (Dual Core, Quad Core) Future will see more than 80 cores in a single chip that needs better communication strategy (Intel) © PSU

Motivation of 3D ICS:: 

Motivation of 3D ICS: Demand of VLSI circuits with features: 1. Increased functionality. 2. low cost. 3. Less power dissipation. Scaling problems of advanced 2D IC designs

APPLICATIONS:: 

APPLICATIONS:

Performance Characteristics: 

Performance Characteristics Timing Energy

Timing: 

Timing Reducing RC delays and increase chip performance

Energy performance: 

Energy performance Wire length reduction has an impact on the cycle time and the energy dissipation Energy dissipation decreases with the number of layers used in the design Following graphs are based on the 3D tool described later in the presentation

BENIFITS:: 

BENIFITS: Foot print. Speed. Power. Design. Cost. Heterogenous integration. Bandwidth. Circuit security.

3DMemory : 

3DMemory No requirement of bulky drives. Cost effectiveness. Non volatile media.

APPLICATIONS:: 

APPLICATIONS: Digital cameras. Digital audio players. PDAs. Smart cellular phones. Gaming devices. Memory cards.

CONCLUSION:: 

CONCLUSION: New Generation of small size, less power dissipation,inexpensive chips New world of design like city skyline Transformed skyscrappers,the world of chips may never look at the same again.