Filtering & Surge Protection Fundamental

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FILTERING AND SURGE SUPPRESSION FUNDAMENTALS:

FILTERING AND SURGE SUPPRESSION FUNDAMENTALS Engr. Roland P. Vasquez RPV Electro Tech. Phils. Corp.

I. Electrical Overstress – The Threat:

I. Electrical Overstress – The Threat It would be difficult , to find someone in today’s high-tech electronics world who hasn’t been affected by electrical overstress. High density of circuit components in this electronic age is susceptible to transient over voltage of a few volts. Microcircuits routinely operate at three or five volts and have low tolerance for transient over voltage.

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Published studies have demonstrated that annual costs of electrical disturbances exceed $30 billion in the USA alone. Data processing downtime attributed to power quality has increased from 27% in 1980 to almost 50% at rest. Almost every user of electronic equipment has observed that equipment either fail outright, go “of-line”, go to “reset”, or experienced shortened life. Computers, from industrial control to personal computers frequently lose their way, act strange or require soft re-start if not exhibiting outright “hard failure”.

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Since there is no “wear-out” phenomena in solid state devices, equipment essentially should never fail. Studies show that 75 to 90% of all electronic failure is due to over voltage stress alone. The balance of failures is usually heat related due to faulty designs. An agreement on common terms to describe electrical overstress has largely eluded the industry; however, the Institute of Electrical and Electronic Engineers (IEEE) and the American National Standard Institute (ANSI) refer to “surge voltages” and “switching transients” in their discussion of recommended practice for protection of electronic equipment in an AC power and data line environment.

Sources of Transient Over voltage:

Sources of Transient Over voltage Sources of transients range from natural phenomena to power disturbances to normal operation of “noisy” electrical equipment. a. Switching Transients b. ESD Transients c. Nuclear Electromagnetic Pulse d. Lightning Transients

a. Switching Transients:

a. Switching Transients Whenever the flow of current is interrupted, transient over voltages are created. As the magnetic field of an inductor collapses, stored energy is released causing a voltage rise that attempts to maintain the current flow. Power utility line faults, load shedding equipment activity and capacitor bank switching are also frequent sources of transient voltage.

b. ESD Transients:

b. ESD Transients Electro-static discharge phenomena is generated from friction of two dissimilar materials. This triboelectric effect is observed as electric charges of opposite polarity built up between two surfaces and then the surfaces are separated. The human body can store as high as 15,000 Volts as one walks across a nylon carpet. Lower voltage discharges would continue to occur but go unnoticed.

c. Nuclear Electromagnetic Pulse:

c. Nuclear Electromagnetic Pulse Similar to a lightning generated EMP, but with a much faster rise time. The electromagnetic pulse is generated when nuclear ordinance is detonated. This threat has caused the military to “radiation harden” most military weaponry and tactical equipment.

d. Lightning Transients:

d. Lightning Transients The most awesome and most damaging source of all transients. Lightning transients are most often discussed by industry transient suppression because they represent the greatest threat and source of transient known. If protective apparatus were designed to withstand the effects of lightning in a harsh industrial environment, then certainly all other threats of lower magnitude would be eliminated.

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Lightning occurs when friction within clouds raises the charge potential to a level sufficient to ionize air and provide a conductive path either from cloud to cloud or cloud to ground. Studies show that the current during the first stroke can exceed 200,000 Amps. Average strikes produce over 20,000 Amps during the first return stroke. ( See figure 1 below)

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FIGURE 1

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Electromagnetic waves are formed by the discharge and radiate at 90 degrees from the path of the strike. So we see electromagnetic waves propagating through air directly away from the discharge. We also observe ground (Earth) currents propagating away from the point of ground strike. Direct strikes on power cables inject high currents into primary circuits producing voltage transients by flowing through ground resistance or through the impedance of the primary circuit. (See figure 2 below)

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MEDIUM STRIKE Distance to Strike Vertical Induced Voltage Km Miles E Field, VM In 1 M (39”) of wire 10 6 110 20 1 6 1100 200 0.1 .06 11,000 2000 FIGURE 2

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Thus, we observe lightning-generated transients flowing into primary circuits through electromagnetic coupling or direct injection. In addition, we observe ground currents flowing into equipment through the equipment ground from nearby ground strikes. These ground currents can cause transient voltage differences of high magnitude across the various ground point within a structure or from structure to structure. In summary, these most severe threat of all can enter equipment via power lines, telephone lines, telecom or data lines, signal or current loop lines and the earth ground connection as well.

2. Results of Transient Over voltage:

2. Results of Transient Over voltage Probably the most disturbing of the effects of transients is that they often go unnoticed. Over voltage transients exist in our everyday world unless we have outright equipment failure or very frequent operating disturbances, most users assume they are “safe”. As equipment is bombarded with destructive transients, its life is shortened. a. Walking Wounded

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Equipment may survive a damaging transient by showing small or no upset, only to fail in six months or so as metallization creep age eventually shorts out the “punch through” hole in the micro circuit junction.

b. Soft Failure:

b. Soft Failure This most common failure of all types, which at best leads to shortened equipment life, an at worst shows latent catastrophic failure. Transient generated soft failures include going “off-line”, reset, run error, communication error, measurement or reading errors, lock-up, lost or corrupted files, latch, output error and so forth.

c. Hard Failure:

c. Hard Failure This failure is easily observed and generally causes concern. This result may be a charred mass of molten electronics, a component with its lid blown off, a cracked or burned component, a vaporized circuit board trace or wire, but sometimes leaves no visible effects. The equipment is just out of service. (See figure 3 below)

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FIGURE 3

II. Suppression Devices:

II. Suppression Devices An electrical overstress may be described as a transient voltage, spike, glitch, etc., but in reality a short-term deviation from normal operating voltage or signal level. As transient voltages increase in amplitude, the risk of disrupting or damaging today’s sophisticated electronic equipment. Transient Voltage Surge Suppression (TVSS) devices sometimes called Surge Protective Devices (SPD) are available in many forms and protection levels. A quality TVSS device will lower the threat and “clamp” or “let through” only voltages that will not harm protected equipment.

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A quality TVSS device will lower the threat level and “clamp” or “let through” on voltages that will not harm protected equipment. Obviously, one must consider all paths to entry when planning protection against the TVSS threat.

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DEVICE KEY CHARACTERISTICS Device V-I Response Curve Speed Insertion Loss (Cap) Energy Capability Follow-on Leakage Cost Ideal Sharp/Flat Fast None Infinite None None Free MOV Sharp/Non-Linear Medium High High None/High High Low SAD Sharp/Flat Fast Low Low None/High Low Mod GDT Erratic/Non-Linear Slow Low High High Low Mod S.C. Block Erratic/Non-Linear Slow Low High None Low Low Air Cap Erratic/Non-Linear Slow Low High None Low Mod Thyristor Sharp/Flat Medium Low High None/High Low Mod Hybrid Sharp/Flat Fast Low High Low Low/High Mod FIGURE 4 – Summary of TVSS Device Characteristics

Characteristics:

Characteristics a. Ideal Device This product is not available, of course, but identifying key desirable features provide as with performance target. b. Metal Oxide Varistor (MOV) A voltage-dependent resistor made of metal oxide particles compressed together. The contact portion of these particles acts like a semiconductor junction. Millions of these junctions act like diodes that turn on at different voltages. As voltage increases more and more junctions conduct.

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The voltage (V) to current (I) relationship is very non-linear. Even manufacturer’s curves, which are plotted on log graphs to flatten the curve, show a pronounced non-linear relationship. The large semiconductor junctions allows s high current leakage rate, but also provides excellent power handling capability

Key features of Metal Oxide Varistor are::

Key features of Metal Oxide Varistor are: High device capacity – each PN junction has capacitance; e.g., 1500pF MOV. Response is fairly fast but non-linear (higher “let through” voltage as higher current is applied. High power handling capability, e.g., 6500 Amps @ 8x20 µs Pulse for a 20 mm MOV. A great deal of the transient energy is dissipated as heat by the MOV. Follow-on current is low except when the device fails, then quite high.

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Leakage is high, e.g., 5 mA at operating voltage for a 20 mm MOV. MOV’s performance degrades with exposure to transients. The effect of exposure is for the MOV actual operating voltage to become lower with each large transient until it equals the applied voltage at which time follow on current will destroy it. This phenomenon can be eliminated by careful test and selection of MOV’s, then configuring them in parallel/redundant circuits. Life can be extended for over 15 years in real-world applications.

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Failure mode – the MOV fails short when overstressed, then follow-on current normally causes catastrophic rupture and an open circuit. So much heat is generated that, unless protected, the PCB may carbonize and allow some leakage current, although the MOV has “opened”. Therefore, proper fusing or circuit breaker selection is essential for MOV based TVSS devices which do not employ integral fusing.

Key features of Silicon Avalanche Diode are::

c. Silicon Avalanche Diode (SAD) A specialized semiconductor device that acts like a zener diode in turn on and current avalanche mode. However, the SAD utilizes a very large silicon chip sandwiched between large metal pellets giving it thousands of times more current carrying capability than a zener. Key features of Silicon Avalanche Diode are: Fastest turn-on of any device available. Response is especially flat, that is as higher voltage is applied, more current will flow in a linear fashion up to the point of device failure.

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Capacity is low. Capacitance is limited to a single PN junction capacitance, e.g., 100 pf for a 24V LCE SAD. Capacitance may be lowered by putting additional diodes in series, however lead inductance must then be accounted for in clamping or “let-through” performance. Energy capability is low, devices are offered in 500, 1500, 5000 and 15000 watt sizes. High wattage devices are expensive.

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Energy dissipation is low in conjunction with low wattage capability, e.g., 15 kW devices often require heat sinking. Junction resistance at avalanche is low resulting in minimal heating. Leakage is extremely low in the order of µ amps. Follow-on current is nil except should the device fail. Failure mode – SAD devices fail short and normally remain “shorted” even with high current flow-on flow. The pellets simply weld together.

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d. Zener Diode The standard zener device should never be used in transient suppression applications. The PN junction area and metal disc size are very small and incapable of handling significant transient current. e. Gas Discharge Tube (GDT) These devices function similar to air or carbon gap devices except they are hermetically sealed and charged with an argon/hydrogen mixture at about 0.1 Bar. Radioactive gases are often added to control spark over.

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f. Silicon Carbide Block An air gap conductor designed years ago as a lightning arrestor. Generally not used for suppression any longer. g. Air Gap Spark over occurs when the air is ionized by a sufficient voltage potential applied across the terminal – used in extremely high lightning risk areas as the primary protection in a multi-stage TVSS device.

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h. Fuses Generally not considered as a TVSS device because of the time required to operate or “clear” and significant currents can flow during these period. These devices are usable only once and must be replaced. Hybrid TVSS devices, however, often utilize fuses in their circuitry to prevent catastrophic rupture of MOV devices.

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i. Surge Relays These devices are utilized to disconnect signal lines in the event of a high current surge – their speed, because of the mechanical motion of contacts. These relays are generally used to disconnect power surges caused by failures in the power system, which are of significant duration. j. Circuit Breakers Used to disconnect power from electronic equipment. Speed of response is in the tens of milliseconds rendering them too slow for normal transient protection.

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k. Thyristors l. Hybrid Devices These silicon semiconductor devices appear in a variety of forms and wattages. These designs are multi-stage units utilizing a variety of the available TVSS discrete devices.

III. Agency Waveforms and Threat Levels:

III. Agency Waveforms and Threat Levels Performance standards have been developed by key agencies in order to make recommendations relative to testing of TVSS equipment and provide standards for comparison of claimed performances. There are three key waveforms that are utilized as primary in the industry. The most common waveform is the “Combination Wave” which has a voltage waveform of 1.2 μ sec rise, 50 μ sec duration into an open circuit, and a current waveform of 8 μ sec rise and 20 μ sec duration into a short circuit. (See figure 5)

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FIGURE 5

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The “Ring Wave” has a damped oscillation with a rise time of 0.5 μ sec and a frequency of 100 kHz. The decay factor is 0.6 during each half cycle. (See figure 6 below) The “Electrical Fast Transient” (EFT) represents transient bursts which occur during inductive load switching or relay contact bounce. (See figure 6 below)

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FIGURE 6

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FIGURE 7 Additional waveforms referenced on ANSI/IEEE are shown on figure 7 & 8.

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FIGURE 8

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The set up for test utilizing these key waveforms is quite complex and expensive. Test equipment capable of forming the very specific high current voltage waveforms repeatedly is required along with great care in lead and probe set up. Specified test lay-out, use of filters and impedance devices and so on is critical and requires significant training. The waveforms for the ANSI Standard are slightly different; also an oscillatory test wave (open circuit) is added. Threat levels as defined by ANSI/IEEE are shown in Figures 10 and 11 below .

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FIGURE 10

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Location Category System Exposure Voltage (kV) Current (kA) Effective Impedance (Ohms) A1 Low 2 0.07 30 A2 Medium 4 0.13 30 A3 High 6 0.2 30 B1 Low 2 0.17 12 B2 Medium 4 0.33 12 B3 High 6 0.5 12 Location Category System Exposure Voltage (kV) Current (kA) Effective Impedance (Ohms) B1 Low 2 1 2 B2 Medium 4 2 2 B3 High 6 3 2 C1 Low 6 3 2 C2 Medium 10 5 2 C3 High 20 10 2 IEEE Location Category Test Values Standard 0.5 µsec – 100 kHz Ring Wave Standard 1.2 x 15 µsec Combination Wave FIGURE 11

IV. Equipment Failure Principals:

IV. Equipment Failure Principals Transient current flow into equipment via electrical conductors. These lines of wires may be AC power hot, neutral, or ground, telephone lines, data-com lines, measurement or control lines or DC power busses. (See figure 12 below) 1. Path of entry Once we realized that today’s microcircuits fail when exposed to transients of even a few volts, we need to understand how transients enter equipment. This is key to proper selection of transient suppression equipment and its installation.

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FIGURE 12

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Wires connected to equipment from outside of buildings represent the greatest threat, next are lines feeding building to building and secondary threats exist where wires are contained within the building. (See figure 13 below)

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FIGURE 13

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Under methods and practice, we will discuss matching transient voltage surge suppressors (TVSS) to the threat level. However, at this point we should recognize that any electrical wire connected to electronic circuitry is a potential path of entry and should be carefully analyzed prior to deciding whether it should have protection. (See figure 14 below)

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FIGURE 14

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A practical approach, which seems to reduce the complexity in analyzing placement of TVSS devices is as follows. Remember that voltage potential applied across an electronic circuit is the base cause of failure. The principal then is to design TVSS devices, which connect to all points of potential voltage threat and clamp or limit both differential and common mode transients to level below equipment failure. For example, in power entry, voltage transients must be limited between line to neutral, line to ground, and neutral to ground. In the case of two data lines both line to line and line to ground modes must be protected.

V. Grounding Principals:

V. Grounding Principals Many believe “If it is grounded (good earth ground of less than 5 Ω ) you won’t have transient problems”. In an oil field in New Mexico, the transmitters were “grounded” by sometimes over a mile of earthed pipe. The company was losing 100 transmitters per month. The problem was of course related back to our principal of transient over voltage occurring on the current loop with respect to ground.

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Sometimes an individual will remove the ground in hopes of avoiding the over voltage problem. In this case the equipment is still subject to line to line transients as well as the ground threat normally remains. The ground threat remains because an insulation between two conductors forms of capacitor, which at lightning frequencies may conduct energy into the equipment. (See figure 15 below)

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FIGURE 15

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Electrical transients that are not absorbed by a suppressor eventually dissipate into the earth. In grounding then, the principal is “get the best earth ground you can” but expect it to significantly reduce transient over voltage failures without using a suppressor.

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The Philippine Electrical Code (PEC) provides for good earthing or grounding at the building entry, and at large sites, driving a ground rod at intervals. When various pieces of electronic equipment are connected via communication lines but have different ground points, voltage differences can be generated. An electromagnetic wave propagating from a lightning strike to earth can elevate ground potentials to several thousand volts with respect to other grounds, power or data lines.

VI. Shielding Principals:

VI. Shielding Principals Many believe that “if equipment is properly shielded” you wont have transient problems. Of course, experience shows this not to be true. The reason is that when the EM wave passes the shielded wires, currents are induced into conduit or shield and travels to the best “earth ground” available. The transient currents are then coupled inductively to the inner conductors, which lead directly to unprotected electronic components. (See figure 16 below)

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FIGURE 16

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Another fallacy is the belief that burying the cable in the earth will prevent transient problems. The earth is essentially transparent to a lightning EM wave so very little attenuation is observed. In shielding, the principal is to used to good shielding on sensitive data lines and ground only one end. Shielding will attenuate Rf and help some with lightning. Always ground the shield at the receiving or measurement side, not both ends. When both ends of a shield are grounded, ground currents can flow conducting noise or creating “ground loops”. (See figure 17 below)

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FIGURE 17

VII. Equipment Protection:

VII. Equipment Protection Once we understand that there exists a life shortening or outright destructive threat to our electronic equipment and the ways this equipment is vulnerable, we need to examine the choices and principals in the selection of protective equipment. (See figure 18 below)

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FIGURE 18

Principal in Equipment Protection:

Principal in Equipment Protection Many questions arise as one considers purchasing transient voltage surge suppressors for his equipment or system. Should I buy protection, how much do I need, where should it be placed, how do I connect it? And so on.

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One must consider the cost of equipment replacement whether immediate or through shortened life. The threat level in this location should be examined, isokaunaric maps consulted for lightning frequency, power quality examined and industrial environment examined for switching/inductive transient generators such as HVAC systems, copiers, motors, pumps, control equipment, etc. A study is not required to determine whether we need suppression, of course, if we have already experienced failures or upset.

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The key is to match the TVSS equipment to the threat level and then be certain all doors or paths of entry are closed, or if some are left open, the risk has at least been examined. (A good general guide is found in Figure 19 below ).

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Equipment Protection Do I need it? Equipment Replacement Cost Downtime Cost Length of lines Threat Level (Lightning, Power Quality, Transient Environment) Problem Experience How much do I need? Primary and Secondary Threats Cost Vs Equipment or Downtime Value Standards Agencies Recommendation 3. How does it install? Main Entry Branch Local Panel Equipment Field Protection FIGURE 19

2. Methods And Recommended Practice:

2. Methods And Recommended Practice Because of the unpredictable nature of transients the threat level and frequency of occurrence may vary widely for a given location. For this reason, it is good practice to use primary protective suppressors for all outdoor and building entry areas. It is also good practice to put primary suppression on any lines going between buildings. (See figure 20 below)

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FIGURE 20

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Previously, we noted all modes should be suppressed and clamped together during a transient. Since the path to ground is several ohms of impedance at transient frequencies at any protected device, clearly the voltage produced can be reflected back into the equipment on the opposite end of the data. Therefore it is always good practice to put suppression on both pieces of equipment that are connected together. Suppression equipment must be located as possible to the equipment it is to protect and the suppressor ground made to common to the chassis. A good earth ground should be provided at this common point where possible. (See figure 21 below)

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Equipment Protection Principal Key Instruction Notes When mounting TVSS Devices Inside an instrument or panel orient the output of the device toward electronic circuiting to be protected. This minimizes radiant energy. Dress input/output leads well apart from each other Connect the suppressor to a good earth ground. Use the largest gauge and shortest ground wire possible. Mount the suppressor, as close to the equipment it is to protect as possible. FIGURE 21

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The recommended practice as noted in ANSI/IEEE for AC power is to place primary protection at the building entrance, branch panel power at each branch panel and equipment level protection right at the equipment. All distributed outlets that power sensitive electronic equipment should have protection added. All signal/data, current loops and control signal lines should have primary suppression. (See figure 22 below)

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FIGURE 22

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FIGURE 23 FIGURE 23 & 24 below show typical applications of TVSS devices protecting field transmitters and receiver/recorder PLC

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FIGURE 24

3. Transient Voltage Surge Suppressor (TVSS) Devices:

3. Transient Voltage Surge Suppressor (TVSS) Devices A number of discrete electronic devices may be used as suppression device or used in hybrid TVSS units. Each type of device has strengths and weaknesses. Hybrid devices take advantage of the strengths of each and minimize the weakness.

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Metal Oxide Varistors (MOV’s) and Gas Discharge Tubes (GDT’s) are able to withstand severe transients. Silicon Avalanche Devices (SAD’s) are unable to withstand severe transients but clamp at very predictable levels, experience no wear out and fail safe (short). MOV’s are offered in a wide variety of AC and DC operating ranges from a few volts to hundred of volts. GDT’s are offered in wider increments starting at 75V and going to several thousand volts. SAD’s are offered in very fine increments from 5V to around 400V. All three devices may be stacked in series to provide alternate total voltages.

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Resistors or inductors are often used in TVSS units to force the bulk of the transient into the primary device and protect the second or third stage. Multi-stage suppressors provide for high-energy absorption, low predictable clamping and often electrical filtering as well. AC main and branch power TVSS devices are normally a shunt type because of the load currents involved. MOV’s and GDT’s are normally used in these locations. Some vendors will use a massive number of SAD type devices in these locations. Data signal and Telco applications will generally be hybrid multi-stage Telco units.

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After one considers the threat, evaluate the risk and decides to procure a TVSS device, a reputable manufacturer or representative knowledgeable in the field should be consulted. TVSS suppliers who are competent in this industry will provide excellent advice regarding adequate design and model selection. Great care should be given in the selection of the TVSS supplier and TVSS model. One should carefully examine specifications in performance claims sometimes are worded to sound good but actual performance to accepted standards is often not referenced or is exaggerated.

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Thank You!!!

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