Protecting The PCB Within The Reflow Furnace - Miracle Aerospace

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Protecting The PCB Within The Reflow Furnace The manufacturing process of a tiny complex PCB having numerous components held onto it is a very extensive and challenging one. All the steps required in the PCB production process need to be followed carefully. While every step right from the designing to the testing is important one very important step is that of substrate formation without which the components will not be able to be held in place. This substrate on which all the components of the PCB are required to be held is formed by passing the PCB into a reflow furnace. However when a PCB is passed through such an oven it is susceptible to bending or warping due to the heat within. So how can this bending and warping be avoided After all no bended or warped PCB will be considered appropriate and thus will not be accepted. Tactic 1 – Reducing the effect of temperature on the PCB One very simple tactic is by keeping the temperature of the reflow furnace low. Also slowing down the speed of warming up and cooling down within the reflow furnace can help reduce the bending and warping of the PCB board. Tactic 2 – Reducing the size of the board and the number of panels Reflow furnaces use chains to drive the PCB board forward. Thus larger the size of the board the more it will be deformed because of its own weight. So either the size of the board itself needs to be reduced or the long side of the board should be placed along the edge of the chain. This will reduce the deformation caused by the weight of the circuit board. This also

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reduces the number of panels as because the narrow side is used to cross the furnace direction the lowest amount of depression is produced. Tactic 3 – Increasing the thickness of the board Using a thin PCB board makes it difficult to keep it from deforming after passing through the reflow furnace. Thus it is recommended that the thickest possible board is used to reduce the amount of bending and deformation. If no thin and lightweight requirement is important opt for a board that is at least 1.6 mm thick. Tactic 4 – Using high glass transition temperature Glass transition temperature is the temperature at which the material changes from a glass state to a rubber state. If this temperature is low the board starts to soften faster after entering the reflow furnace thus making it easy for the board to deform. Instead if the glass transition temperature is set to high the board will be able to withstand higher stress deformation. However a higher glass transition temperature will make the PCB costlier. Tactic 5 – Using a reflow carrier Using a reflow carrier is another option as this over-tray can reduce the bending of the board. Whether it is thermal expansion or contraction the furnace tray can fix the circuit board and after the board is lower than the glass transition temperature it can maintain the original size after starting to harden again. However again the tool and labour costs of using a reflow carrier is high thus adding to the cost of the PCB. With all these methods a PCB can be easily protected against deforming when passed through the reflow furnace. Miracle Aerospace is an expert in manufacturing every kind of PCB assembly from India thus they know all the tactics and strategies to bring to you the perfect and the most durable PCB. So make sure you outsource your PCB production to an expert like Miracle so that you need not have to worry about any of that mentioned above.

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