Chip processing techniques

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Chip processing techniques

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By: slal2011 (14 month(s) ago)

Is there a way I can get permissions to download this ppt? or can you email me at sweata.lal@gmail.com

By: saeeed3 (14 month(s) ago)

good presentation

Presentation Transcript

Semiconductor Wafer Processing: 

Semiconductor Wafer Processing 1 From Crystal to Integrated Circuit

Learning Resources: 

Learning Resources 2

Background Knowledge: 

Background Knowledge 3

Terminologies: 

Terminologies Etching Wafer Cleaning Diffusion Metallization Electrode Packaging Testing 4

Learning Outcomes: 

Learning Outcomes 5

Introduction: 

Introduction 6

The Chip MakingProcess: 

The Chip MakingProcess 7

Making the Wafer: 

Making the Wafer 8

Wafer Preparation : 

Wafer Preparation 9

Wafer Preparation : 

Wafer Preparation 10

The Mask Making Process: 

The Mask Making Process 11

Epitaxy: 

Epitaxy 12

Photolithography Process: 

Photolithography Process 13

Mask and Lithography : 

Mask and Lithography 14

Photolithography Processes: 

Photolithography Processes 15

Oxidation and Exposure: 

Oxidation and Exposure 16

Etching and Stripping: 

Etching and Stripping 17

Etching: 

Etching 18

Diffusion and Implantation: 

Diffusion and Implantation 19

Diffusion: 

Diffusion 20

Thermal diffusion: 

Thermal diffusion 21

Thermal Diffusion: 

Thermal Diffusion Furnace for diffusing impurities (e.g. phosphorus) into silicon. 22

Implantation: 

Implantation 23

Ion Implantation: 

Ion Implantation 24

Ion Implantation: 

Ion Implantation 25

Deposition: 

Deposition 26

Oxidation: 

Oxidation 27

Inter connection: 

Inter connection 28

Metallization: 

Metallization 29

Metalization : 

Metalization 30

Chemical Mechanical Planarization: 

Chemical Mechanical Planarization 31

Inter connect - Layers: 

Inter connect - Layers 32

Inspection & Measurement: 

Inspection & Measurement 33

Inspection: 

Inspection 34

Test, Assembly and Packaging: 

Test, Assembly and Packaging 35

Wafer Probe or Test: 

Wafer Probe or Test 36

Memory Repair: 

Memory Repair 37

Assembly and Packaging: 

Assembly and Packaging 38

Package Test: 

Package Test 39

Group Work Assignment: 

Group Work Assignment Chemical Etching Wafer Cleaning Wafer Testing Dice Separation Metallization Electrode Packaging Testing Elaborate the integrated circuit (chip) making techniques . The discussion must include the following processes. Prepare also a poster with A0 size). 40