11h20-12h00 Danfoss RoHS(1.2)

The RoHS DirectiveImplementation : 

EOTC2003© - #1 The RoHS DirectiveImplementation RoHS may be more expensive for OEMs than WEEE OEMs need to be ready at least 1 year before implementation due to “design cycles” – i.e. 1 July 2005 Certain applications cannot be substituted by 1 July 2006 such as: Lead in high melting temperature solder Lead in ceramic electronic parts, such as piezo devices

The RoHS DirectiveLead Health Effects : 

EOTC2003© - #2 The RoHS DirectiveLead Health Effects Effects on the Central Nervous System, particularly in children Inhibits mental development in children Damages kidneys and reproductive system Can cause anemia (blood disorder)

The RoHS DirectiveMaterials alternative to lead : 

EOTC2003© - #3 The RoHS DirectiveMaterials alternative to lead Lead solder substituted with lead free solder Soldered connectors substituted with press-fitted connectors

The RoHS DirectiveLead free solders : 

EOTC2003© - #4 The RoHS DirectiveLead free solders Most of the technical work to-date has concentrated on identifying alternative solder materials to the present lead-containing solders and the associated attachment processes, along with reliability assessments of the solder joints formed with lead-free solders

The RoHS DirectiveStatus of lead free manufacturing : 

EOTC2003© - #5 The RoHS DirectiveStatus of lead free manufacturing Industry is putting significant effort (time/money) to ensure conversion is successful by the timelines stipulated in the RoHS Directive Implications of replacement materials Energy (higher temperature) Components (higher temperature ratings) Boards (higher temperature ratings) Solder (contains silver, patent royalty issues) Equipment (10-12 zone furnaces required) Wave solder equipment Lower yields/higher scrap rates

The RoHS DirectiveStatus of lead free manufacturing : 

EOTC2003© - #6 The RoHS DirectiveStatus of lead free manufacturing Key Challenges Technical data generation and evaluation: Solder joint reliability Component/board reliability (higher processing temps) Forward/backward compatability Reflow profile control Tin whiskers may form, causing shorts

The RoHS DirectiveStatus of lead free manufacturing : 

EOTC2003© - #7 The RoHS DirectiveStatus of lead free manufacturing Logistical Issues: Part Numbers Need new part numbers for all items not backwards compatible BOM (Bill of Materials) Control Control to avoid mixing of lead-free with old components (potential solder joint reliability concern)

The RoHS DirectiveStatus of lead free manufacturing : 

EOTC2003© - #8 The RoHS DirectiveStatus of lead free manufacturing Logistical Issues: Excess inventory What to do with lead-containing inventory after cut off? How to manage last-time buys of lead-containing product? Component availability

The RoHS DirectiveConclusions and next step : 

EOTC2003© - #9 The RoHS DirectiveConclusions and next step Technical solutions being worked on but need adequate time/effort to resolve reliability issues Manufacturers and component suppliers are educated and working hard to meet the deadlines, but again, time to ensure reliability of replacement materials is needed

The RoHS DirectiveConclusions and next step : 

EOTC2003© - #10 The RoHS DirectiveConclusions and next step Need for precise definitions Industry working to clarify There are serious logistics issues Product qualifications are complex and time-consuming; they take time/resources, especially if components require changing and re-qualifications

Questions ?? : 

Thank you… Please feel free to contact us prospection@eotc.be EOTC aisbl • Rue de Stassart, 36 • B-1050 Brussels • BelgiumTel +32 2 502 41 41 • Fax +32 2 502 42 39 • Email: estelle.desmit@eotc.be www.eotc.be Questions ??