PCB line card

Double sided PCB:

Double sided PCB 1) 190*130mm/10up, FR-4, Tg 135, CTI 175-225V 2) Dielectric constant(Er): 4.4-5.2 3) 2 layers, 1.6mm thick, 1 oz 4) Min. hole size: 0.3mm 5) Min. track/space: 4/4 mils 6) LPI Solder mask/White legend 7) Fiducial mark, tooling strips, mounting holes 8) Finish: immersion gold

Aluminum based PCB:

Aluminum based PCB 1) 72*36mm/2up 2) Thermal conductivity: 0.8-1.3 W/mk, 3) Single sided, 1.6mm 4) White solder mask/ Black Legend 5) Copper weight: 35μm 6) Surface Finish: HASL Lead free 7) Contour: Punch, V-Groove, countersink hole

Bergquist T-clad IMS PCB:

Bergquist T-clad IMS PCB 1). 80*50mm/1up, Bergquist Thermal Clad aluminium backed 2). HT-04503,MP-06503,HT-07006 3). Ceramic dielectric material, conductivity: 1.3W/m-k, 2.2W/m-k, 4). 1.6mm thick, single sided, 35μm (1 oz) 5). Black solder mask/no ident 6). CNC rout outline 7). Immersion gold

Laird T-preg IMS PCB:

Laird T-preg IMS PCB 1). 40*40mm/1up, Laird aluminium backed 2). T-Prepreg 1KA04, 1KA06, 1KA08 3). Low Thermal Resistance for Cool & Efficient LED Operation 4). 1.6mm thick, single sided, 35μm (1 oz) 5). White solder mask/No legend 6). Surface finish: ENIG 7). Contour: Punch, cup-shape hole

XPC /FR-1 PCB:

XPC /FR-1 PCB 1) Single Sided PCB 2) Material: XPC (94HB), FR-1 (94V0) 3) Thickness: 1.0mm, 1.2mm, 1.6mm 4) Copper weight: 0.5 oz, 1 oz 5) UV solder mask 6) Profile: Punch/ rout 7) Surface finish: OSP, Electro Gold, Nickle plate

Silver through hole PCB:

Silver through hole PCB 1). Silver through hole (STH) 2). Material: FR-1, CEM-1 3). Double sided, 1.6mm, 1oz 4). Green solder mask/white silk screen 5). OSP finish 6). Contour profie: Punch

CEM-1 /CEM-3 PCB:

CEM-1 /CEM-3 PCB 1). 90*45mm/2up, CEM-1/CEM-3, 2). Single sided, 1.6mm 3). 1 oz copper finished 4). Green solder mask/white silkscreen letter 5). OSP surface finish 6). Contour profile: punch

High frequency PCB:

High frequency PCB 1) Woven Glass-Reinforced PTFE 2) Single side/Double sided, 3) Dielectric constant Er:= 2.55, 2.65, 2.75, 2.90, 3.0, 3.5 4) Copper weight: 0.5 - 3 oz 5) PCB thickness: 0.17-3.0mm 6) Track/space: per drawing 7) Finish: Copper finish.

Rogers PCB:

Rogers PCB 1) RO4350B and RO4003C 2) Thickness: RO4350B RO4003C 4mil(0.1mm) 12mil(0.3mm) 10mil(0.254mm) 20mil(0.508mm) 13.3mil(0.338mm) 32mil(0.813mm) 20mil (0.508mm) 60mil(1.524mm) 30mil(0.762mm) 60mil(1.524mm) 3) 1/1 oz copper thickness 4) Line space width: 0.15-0.2mm 5) Green solder mask/white ident 6) Immersion gold.

Taconic PCB:

Taconic PCB 1). 221*80mm, TLX08-300 CI/CI, 2). Thickness of CCL availalbe 20mil(0.5mm) 30mil(0.762mm) 40mil(1.0mm) 3). ER 2.55, 1 OZ 4). Double sided. 5). No solder mask/ NO ident 6). OSP

High CTI PCB:

High CTI PCB 1) 160*160mm, FR-4 CTI ≥ 600V 2) 8 layer 3) Finished inner/outer: 35 μm 4) LPI Green mask/white silk 5) Min hole 0.19mm, 5/3 track/gap 6) 1.6mm +/-10% thick 7) Immersiong gold over nickel 8) High voltage, Hihg temperature, moisture envirionment.

Thick PCB:

Thick PCB 1). 20*50mm/1up, 5mm thick 2). FR-4 material, 35 μm copper 3). Green solder mask /white silk screen. 4). Through hole, PTH 5). Hot air level Pb free 6). Application: motor, medical equipment, industrial products.

Impedance control PCB:

Impedance control PCB 1). 230*230mm/1up, FR-4 Tg 170 2). 4 layers, 35 μm copper, 2.5mm thick 3). Min.track/space: 4/4 mil 4). Min. hole size: 0.25mm 5). 50 ohm, 100+/-10% ohm differential /single impedance control 6). Immersion gold 7). High power electronics

PCB prototype:

PCB prototype 1). PCB prototypes to small volume. 2). FR-4, 0.3-5mm thick, 1-10 oz 3). 1-30 Lalyer 4). LPI Green solder mask/White legend 5). HASL, ENIG, OSP, Immersion silver 6). Blind via, Via in pad, Micro BGA 7). MOQ 1 PCS

High Tg PCB:

High Tg PCB 1). 90*90mm/1up, ITEQ IT180A, FR-4 Tg170 2). 10 layer, 1.6mm thick 3). 35 μm copper finished 4). LPI Green solder mask/ white legend 5). Immersion gold (ENIG) 6). Differential impedance control 90 ohm/100 ohm +/-10% on track 0.1mm 7). Good for high-count layer PCB, Widely used in computer, communication equipment, precise apparatus and instrument, router, and etc

HDI PCB:

HDI PCB 1). 1+C+1 HDI, buried/blind L1-L5/L5-L8 vias. 2). FR-4 Material, 1 oz weight. 3). 8 layer, 1.6mm thick. 4). 4/4 mils track and space 5). Min.drill 0.1mm 6). Green solder mask/ white silkscreen 7). Immersion gold over nickel

24 hours prototype:

24 hours prototype 1). Size: 45*140mm/1 up 2). Layer count: 2 Layer, 20 μm PTH 3). Thickness: 1.6mm +/- 10% 4). Copper weight(Finished): 35 μm 5). SMOBC: LPI Green solder mask/ White legend 6). Holes: 0.4mm minimum, 4/4 mil track/space 7). Pads finish: HASL

Save setup cost PCB:

Save setup cost PCB 1). 14 different PCB's in one Panel within 400 x 500mm 2). Same material and Thickness. 2). FR-4 Material, Double sided. 3). 1 oz copper weight, 1.6mm thick. 4). Green solder mask /white silkscreen 5). Hot air level finish

Gold finger PCB:

Gold finger PCB 1). 98*32mm/1up, FR-4 Material 2). 8 layer, 1.0mm thick, 35 μm (1 oz) 3). LPI Green solder mask/White silk screen legend 4). HASL + Gold finger 5). 30 microinch(μ") hard gold, edge bevelled. 6). Contour: CNC rout

Heavy copper PCB:

Heavy copper PCB 1). 112*63mm/1up, FR-4 2). 2 layer, 1.6mm thick 3). 10 oz(350μm) copper weight. 4). 0.3mm finished hole 5). LPI Green solder mask/White silk screen 6). HASL Lead free

PCB with peelable mask:

PCB with peelable mask 1). Peters peelable mask on back side 2). 174 x 212mm, FR-4 Tg170 3). 4 layer,1.6mm, 1oz 4). Green solder mask/white silk letter 5). 50 ohm single impedance control 6). Immersion gold

Via in pad PCB:

Via in pad PCB 1). 80 *190mm/2up, FR-4 2). 6 layers at 1.4mm thick 3). 35 μm copper weight 4). Green solder mask LPI/White legend 5). ENIG surface finish 6). Blind via from Layer 1 to layer 2 7). Via in pad plugged conductive resin

Micro BGA PCB:

Micro BGA PCB 1). 177 x 75mm (2UP), FR-4 Tg 170 2). 1.6mm +/-10%, 6 layer 3). Min. hole 0.15mm, 4/4 track/gap 4). Finished copper weight inner/outer 1 oz 5). Green solder mask/ White ident 6). Immerstion gold. 7). Fine pitch and micro BGA

CSP PCB:

CSP PCB 1). 100mm x 98mm/1up, FR-4, 2). 1mm +/-0.1mm,6 Layers 3). 1oz copper finished 3). Green solder mask/white legend 4). Min. hole 0.15mm, 4/4 mil track/gap 5). Blind via layer 1-2, via-in-pad. 6). Immersion gold surface finish

SMT Stencil:

SMT Stencil 1). Laser cut stencil 2). 12" x 12" to 28" x 28", aluminum framed 3). Stainless steel shim 4). PCB locate in the middle of the squeegee area 5). Engraving and electro polishing 6). Good use for CSP, BGA, Fine QFP package

Prototype of rigid-flex PCB:

Prototype of rigid-flex PCB 1). 100*85mm, FR-4 Tg170/ Polyimide 2). 4 layer count rigid/2 layer flex 3). 1.0mm thick rigid/0.15mm thick flex 4). 1 oz each layer 5). Green LPI solder mask/white ident 6). Immersion gold

Combined material PCB:

Combined material PCB 1). FR-4 Tg 170 + Rogers RO4003C 2). 290*130mm/1up 3). 6 layers at 1.6mm thick 4). Green solder mask/White ident 5). 35um copper finished, ED copper. 6). Immersion gold 7). Countersunk slots.

LED Strips IMS PCB:

LED Strips IMS PCB 1). Strip size 580*17mm 2). Aluminum base, 1.0mm, 1oz 3). Single sided layer 4). White solder mask/Black legend 5). HASL 6). LED high power

Composite IMS PCB:

Composite IMS PCB 1) 52*52mm round 2) Thermal conductivity: 0.8-1.3 W/mk, 3) Single sided, 1.6mm 4) White solder mask/ Black Legend 5) Copper weight: 35μm 6) Surface Finish: ENIG 7) Contour: Punch