logging in or signing up from macro to micro 6 ahilam Download Post to : URL : Related Presentations : Share Add to Flag Embed Email Send to Blogs and Networks Add to Channel Uploaded from authorPOINT lite Insert YouTube videos in PowerPont slides with aS Desktop Copy embed code: (To copy code, click on the text box) Embed: URL: Thumbnail: WordPress Embed Customize Embed The presentation is successfully added In Your Favorites. Views: 24 Category: Entertainment License: All Rights Reserved Like it (0) Dislike it (0) Added: October 24, 2011 This Presentation is Public Favorites: 0 Presentation Description No description available. Comments Posting comment... Premium member Presentation Transcript Slide 1: Let’s Have a Closer Look……. …Into the Matter Stuff is Always Around Us. Did you Ever Stop To Think What’s Inside ?? Technion – Israel Institute of Technology Department of Materials Engineering הטכניון – מכון טכנולוגי לישראל הפקולטה להנדסת חומריםSlide 2: Naked eye Light Emitting Diode (LED) 1 cm USB Flash Drive Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 3: Naked eye 1 cm Light Emitting Diode (LED) Stripped USB Flash Drive Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 4: 200 microns Optical Microscopy LED Chip Copper wire 20 microns in diameter Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 5: 200 µm Optical Microscopy Let’s Zoom into the LED Chip Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 6: Optical Microscopy 100 µm LED at Work: Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 7: Optical Microscopy 50 µm OFF (0 Volt) Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 8: Optical Microscopy 50 µm ON (1 Volt) Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 9: Optical Microscopy 50 µm ON (2 Volt) Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 10: Optical Microscopy 50 µm ON (3 Volt) Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 11: Optical Microscopy 100 µm Cross-Section View Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 12: 100 µm Optical Microscopy Substrate ( GaAS ) Bottom Contact (Copper) Plastic Circuit Board (Fiber Glass) Top Contact (Gold) Packaging (Polycarbonate) LED Active Layers Cross-Section V iew of the LED Paste (Silver) Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 13: Scanning Electron Microscopy 100 micron Substrate ( GaAS ) Bottom Contact (Copper) Plastic Circuit Board (Fiber Glass + Polymer) Top Contact (Gold) Packaging (Polycarbonate) LED Active Layers Same Cross-Section, Different Microscope Paste (Silver) Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 14: Scanning Electron Microscopy 100 µm Substrate ( GaAS ) Bottom contact (Copper) Plastic Circuit Board (Fiber Glass + polymer) Packaging (Polycarbonate) LED active layers Zoom into the Plastic Circuit Board Paste (Silver) Top Contact (Gold) Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 15: 100 µm Criss -Cross Glass Fibers Polymer Matrix Plastic Circuit Board (PCB) Scanning Electron Microscopy Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 16: 100 µm Optical Microscopy Zoom out Substrate ( GaAS ) Bottom Contact (Copper) Plastic Circuit Board (Fiber Glass) Top Contact (Gold) Packaging (Polycarbonate) LED Active Layers Paste (Silver) Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 17: Substrate ( GaAS ) Bottom Contact (Copper) Plastic Circuit Board (Fiber Glass) Top Contact (Gold) Packaging (Polycarbonate) LED Active Layers 100 µm Optical Microscopy Now Let’s Zoom into the Bottom Contact Paste (Silver) Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 18: 10 µm Optical Microscopy Coating (Nickel) Contact (Copper) Packaging (Polycarbonate) Plastic Circuit Board (Fiber Glass) Bottom Contact Paste (Silver) Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 19: Scanning Electron Microscopy 10 microns Packaging (Polycarbonate) Plastic Circuit Board (Fiber Glass) Coating (Nickel) Contact (Copper) Bottom Contact by Electron Microscopy Paste (Silver) Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 20: Zoom Out Again.. 100 microns Optical Microscopy Substrate ( GaAS ) Bottom contact (Copper) Plastic Circuit Board (Fiber Glass) Top Contact (Gold) Packaging (Polycarbonate) LED Active Layers Paste (Silver) Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 21: Substrate ( GaAS ) Bottom contact (Copper) Plastic Circuit Board (Fiber Glass) Top Contact (Gold) Packaging (Polycarbonate) LED Active Layers Paste (Silver) And Now, Zoom Into the Contact 100 microns Optical Microscopy Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 22: 20 µm Contact (Gold) LED Active Layers Substrate ( GaAS ) Optical Microscopy Top Contact Copper Wire (seen through the packaging) Active Layer 1 ( GaP ) Active Layer 2 ( InP ) Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 23: 20 µm Contact (Gold) LED Active Layers Substrate ( GaAS ) Optical Microscopy Zoom Into the Top-Contact/LED Interface Copper Wire (seen through the packaging) Active Layer 1 ( GaP ) Active Layer 2 ( InP ) Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 24: Contact (Gold) LED Active Layers Active Layer 1 ( GaP ) Active Layer 2 ( InP ) Substrate ( GaAs ) Top-Contact/LED Interface 10 microns Scanning Electron Microscopy Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 25: Contact (Gold) LED Active Layers Active Layer 1 ( GaP ) Active Layer 2 ( InP ) Substrate ( GaAs ) Zoom Farther Into the Active Layers Scanning Electron Microscopy 10 microns Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 26: 5 nano -meters Transmission Electron Microscopy GaP InP GaAs Active Layers Note the scale!! This is REALLY small.. Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 27: 5 nano -meters Transmission Electron Microscopy GaP InP GaAs Zoom Even More, Into the GaP Layer Note the scale!! This is REALLY small.. Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 28: 1 nm Lattice Image at Atomic Resolution Transmission Electron Microscopy This is how the Ga and As atoms are arranged in the GaAs crystal !!! Ga As Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 29: Remember Where it All Began?? Naked eye 1 cm Technion – Israel Institute of Technology, Department of Materials Engineering You do not have the permission to view this presentation. In order to view it, please contact the author of the presentation.
from macro to micro 6 ahilam Download Post to : URL : Related Presentations : Share Add to Flag Embed Email Send to Blogs and Networks Add to Channel Uploaded from authorPOINT lite Insert YouTube videos in PowerPont slides with aS Desktop Copy embed code: (To copy code, click on the text box) Embed: URL: Thumbnail: WordPress Embed Customize Embed The presentation is successfully added In Your Favorites. Views: 24 Category: Entertainment License: All Rights Reserved Like it (0) Dislike it (0) Added: October 24, 2011 This Presentation is Public Favorites: 0 Presentation Description No description available. Comments Posting comment... Premium member Presentation Transcript Slide 1: Let’s Have a Closer Look……. …Into the Matter Stuff is Always Around Us. Did you Ever Stop To Think What’s Inside ?? Technion – Israel Institute of Technology Department of Materials Engineering הטכניון – מכון טכנולוגי לישראל הפקולטה להנדסת חומריםSlide 2: Naked eye Light Emitting Diode (LED) 1 cm USB Flash Drive Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 3: Naked eye 1 cm Light Emitting Diode (LED) Stripped USB Flash Drive Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 4: 200 microns Optical Microscopy LED Chip Copper wire 20 microns in diameter Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 5: 200 µm Optical Microscopy Let’s Zoom into the LED Chip Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 6: Optical Microscopy 100 µm LED at Work: Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 7: Optical Microscopy 50 µm OFF (0 Volt) Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 8: Optical Microscopy 50 µm ON (1 Volt) Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 9: Optical Microscopy 50 µm ON (2 Volt) Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 10: Optical Microscopy 50 µm ON (3 Volt) Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 11: Optical Microscopy 100 µm Cross-Section View Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 12: 100 µm Optical Microscopy Substrate ( GaAS ) Bottom Contact (Copper) Plastic Circuit Board (Fiber Glass) Top Contact (Gold) Packaging (Polycarbonate) LED Active Layers Cross-Section V iew of the LED Paste (Silver) Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 13: Scanning Electron Microscopy 100 micron Substrate ( GaAS ) Bottom Contact (Copper) Plastic Circuit Board (Fiber Glass + Polymer) Top Contact (Gold) Packaging (Polycarbonate) LED Active Layers Same Cross-Section, Different Microscope Paste (Silver) Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 14: Scanning Electron Microscopy 100 µm Substrate ( GaAS ) Bottom contact (Copper) Plastic Circuit Board (Fiber Glass + polymer) Packaging (Polycarbonate) LED active layers Zoom into the Plastic Circuit Board Paste (Silver) Top Contact (Gold) Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 15: 100 µm Criss -Cross Glass Fibers Polymer Matrix Plastic Circuit Board (PCB) Scanning Electron Microscopy Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 16: 100 µm Optical Microscopy Zoom out Substrate ( GaAS ) Bottom Contact (Copper) Plastic Circuit Board (Fiber Glass) Top Contact (Gold) Packaging (Polycarbonate) LED Active Layers Paste (Silver) Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 17: Substrate ( GaAS ) Bottom Contact (Copper) Plastic Circuit Board (Fiber Glass) Top Contact (Gold) Packaging (Polycarbonate) LED Active Layers 100 µm Optical Microscopy Now Let’s Zoom into the Bottom Contact Paste (Silver) Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 18: 10 µm Optical Microscopy Coating (Nickel) Contact (Copper) Packaging (Polycarbonate) Plastic Circuit Board (Fiber Glass) Bottom Contact Paste (Silver) Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 19: Scanning Electron Microscopy 10 microns Packaging (Polycarbonate) Plastic Circuit Board (Fiber Glass) Coating (Nickel) Contact (Copper) Bottom Contact by Electron Microscopy Paste (Silver) Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 20: Zoom Out Again.. 100 microns Optical Microscopy Substrate ( GaAS ) Bottom contact (Copper) Plastic Circuit Board (Fiber Glass) Top Contact (Gold) Packaging (Polycarbonate) LED Active Layers Paste (Silver) Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 21: Substrate ( GaAS ) Bottom contact (Copper) Plastic Circuit Board (Fiber Glass) Top Contact (Gold) Packaging (Polycarbonate) LED Active Layers Paste (Silver) And Now, Zoom Into the Contact 100 microns Optical Microscopy Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 22: 20 µm Contact (Gold) LED Active Layers Substrate ( GaAS ) Optical Microscopy Top Contact Copper Wire (seen through the packaging) Active Layer 1 ( GaP ) Active Layer 2 ( InP ) Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 23: 20 µm Contact (Gold) LED Active Layers Substrate ( GaAS ) Optical Microscopy Zoom Into the Top-Contact/LED Interface Copper Wire (seen through the packaging) Active Layer 1 ( GaP ) Active Layer 2 ( InP ) Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 24: Contact (Gold) LED Active Layers Active Layer 1 ( GaP ) Active Layer 2 ( InP ) Substrate ( GaAs ) Top-Contact/LED Interface 10 microns Scanning Electron Microscopy Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 25: Contact (Gold) LED Active Layers Active Layer 1 ( GaP ) Active Layer 2 ( InP ) Substrate ( GaAs ) Zoom Farther Into the Active Layers Scanning Electron Microscopy 10 microns Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 26: 5 nano -meters Transmission Electron Microscopy GaP InP GaAs Active Layers Note the scale!! This is REALLY small.. Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 27: 5 nano -meters Transmission Electron Microscopy GaP InP GaAs Zoom Even More, Into the GaP Layer Note the scale!! This is REALLY small.. Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 28: 1 nm Lattice Image at Atomic Resolution Transmission Electron Microscopy This is how the Ga and As atoms are arranged in the GaAs crystal !!! Ga As Technion – Israel Institute of Technology, Department of Materials EngineeringSlide 29: Remember Where it All Began?? Naked eye 1 cm Technion – Israel Institute of Technology, Department of Materials Engineering