memory stress test

Memory Stress test : 

Memory Stress test Trailokya nath Sasamal M.Tech(DTI) Roll No-09305EN022

Slide 2: 

CST Inc, calls the test method - "ABT" or “Accelerated Burn-in Technology.” Memory Burn-in Strategy: Static Burn-in(70 to 80’c) Low Frequency Burn-in Dynamic burn-in(Full frequency operation) DIMM Memory Stress Test Dual In Memory module

Slide 3: 

Memory modules to be subjected to near "Boiling-point" . Under influence of Heat-Stress in a controlled Heater Box. Adding voltage bouncing on the memory bus voltages. Overclocking the memory bus by 10% over its recommended speed.

: 

Clock Testing : DDR3 DIMM data rate(800 MHZ to 1333 MHZ ) DDR2 DIMM data rate(400,533,667,800MHZ) DDR1 DIMM data rate (200,33,400,500MHZ) Functional Test: Multiple user Defined test patterns to detect shorts and opens. DC-Parametric Test(detect minute leakage current ) SPD Programming(serial presence detect)

Premature component failure : 

Premature component failure Infant mortality decreasing failure rate wear-out increasing failure rate

Slide 6: 

Two Rapid Heat Chamber: Burn-In Heater box having Halogen Lamps for rapid temperature ramp up(90 deg.).  Thermonics forced air system put forced heated air onto the memory module under test

Slide 7: 

Method of testing memory in large quantity  :Using PC Motherboard and Memory Diagnostic Software(MEMTEST86+).  Memory Application Tester(MAT), built with an actual Intel Motherboard, integrated video, keyboard, USB port. MAT quickly boots-up and displays the memory size, CPU Clock and Memory frequency.

“Memory Application Tester" :pin-point bad error bits location very accurately. :An optional Heater Box . : 

“Memory Application Tester" :pin-point bad error bits location very accurately. :An optional Heater Box .

Slide 9: 

DIM modules SODIM module DIMM slot Small Outline Dual inline Memory module