logging in or signing up 681Topic1 Renzo Download Post to : URL : Related Presentations : Share Add to Flag Embed Email Send to Blogs and Networks Add to Channel Uploaded from authorPOINTLite Insert YouTube videos in PowerPont slides with aS Desktop Copy embed code: (To copy code, click on the text box) Embed: URL: Thumbnail: WordPress Embed Customize Embed The presentation is successfully added In Your Favorites. Views: 316 Category: Education License: All Rights Reserved Like it (0) Dislike it (0) Added: February 13, 2008 This Presentation is Public Favorites: 0 Presentation Description No description available. Comments Posting comment... Premium member Presentation Transcript Open Discussion of Design Flow: Open Discussion of Design Flow Today’s task: Design an ASIC that will drive a TV cell phone Exercise objective: Importance of codesignLayout Styles: Layout Styles Full-custom Gate-array Standard-cell Macro-cell FPGA (Field Programmable Gate-Array)Full-custom: Full-custom Complete control over transistor and interconnect dimensions (within design rule constraints) Produces Optimized Design (density, power, performance) Circuit Designers create application-specific building blocks Technology Provider (foundry) provide SPICE/HSPICE transistor models, parasitic extraction tools Models are used to drive transistor sizing/layout constraints Layout technician creates graphics from design schematic Top level down/Bottom level up Continual verification of design as it becomes more definedDesign Rule Constraints: Design Rule Constraints Minimum Spacing Between metal lines (varies per layer) Line width Transistor channel lengths Active area Via stacks (Check from work) Full-custom Disadvantages: Full-custom Disadvantages Most time-consuming Most error-prone Highest NRE (non-recurring expense) Design time Layout time Mask costs Longest time to manufactureGate-array Layout: Gate-array Layout Transistors pre-placed, fixed in size Personalized by metal routing Fastest to manufacture Lowest mask cost Lends itself to automated placement and wiring Gate Array: Gate Array Vdd Gnd Horizontal Routing Channel Vertical Routing Channel Sea of Gates: Routing Channels removed, route at higher metal layersGate Array Example: Gate Array Example Vdd Gnd A A B B Vdd Vdd Schematic A A B B Out Out Gate-array Disadvantages: Gate-array Disadvantages Non-optimized spacing Limited transistor sizing options Density Performance Power Wiring blockages/inefficiencies Excess circuitryStandard Cell Layout: Standard Cell Layout Design partitioned into cells of standard height Power and Ground (Power grid) wiring preset Technology provider supplies libraries of pre-designed cell elements for usage (utilize varying numbers of cells) Primitives (NAND, NOR, etc.) Storage Elements (DFF) Libraries can be tailored to specific applications (e.g., low power vs. high performance) Requires full manufacturing sequence Typically automated place and wiringStandard Cell Layout: Standard Cell Layout Routing Channel Routing Channel Feed-through cell Note uniform heightOur Cell Library: Our Cell Library Need specifics on library students will be usingStandard Cell Disadvantages: Standard Cell Disadvantages Cell height restrictions limits cell library contents Full set of masks Longer manufacturing timesMacro-cell Layout: Macro-cell Layout Library elements provided by technology supplier (e.g., foundry) Elements can be of varying heights and widths Richer variety of library elements (IP friendly) Macro-cell Disadvantages: Macro-cell Disadvantages Similar to Standard-cell in length of manufacturing times, mask costs Placement and wiring more complex Pre-layout of power grid more difficult, may not be possibleFPGA: FPGA Field Programmable Gate Array Array of logic blocks (Configurable Logic Blocks CLB) Switchable interconnect resources Wire segments of varying lengths Programmable switches that connect logic resources to wire segments Final user sets switches (CLB and interconnect) Immediate Use (“zero” fab time) Minimal expense Great for hardware prototypingSlide17: FPGA: Virtex-II Architecture Virtex™-II architecture’s core voltage operates at 1.5V I/O Blocks (IOBs) Configurable Logic Blocks (CLBs) Clock Management (DCMs, BUFGMUXes) Block SelectRAM™ resource Dedicated multipliers Programmable interconnect © 2005 Xilinx, Inc. All Rights Reserved For Academic Use OnlySlices and CLBs: Slices and CLBs Each Virtex-II CLB contains four slices Local routing provides feedback between slices in the same CLB, and it provides routing to neighboring CLBs A switch matrix provides access to general routing resources CIN COUT COUT Local Routing CIN SHIFT © 2005 Xilinx, Inc. All Rights Reserved For Academic Use OnlySimplified Slice Structure: Slice 0 D Q CE PRE CLR D Q CE PRE CLR Simplified Slice Structure Each slice has four outputs Two registered outputs, two non-registered outputs Two BUFTs associated with each CLB, accessible by all 16 CLB outputs Carry logic runs vertically, up only Two independent carry chains per CLB © 2005 Xilinx, Inc. All Rights Reserved For Academic Use OnlyFPGA Disadvantages: FPGA Disadvantages Least efficient use of silicon/wiring resources Limited size options Limited performance Not good for high volume applications If used for prototyping, still may have significant changes when migrate to higher performance design and package solution You do not have the permission to view this presentation. In order to view it, please contact the author of the presentation.
681Topic1 Renzo Download Post to : URL : Related Presentations : Share Add to Flag Embed Email Send to Blogs and Networks Add to Channel Uploaded from authorPOINTLite Insert YouTube videos in PowerPont slides with aS Desktop Copy embed code: (To copy code, click on the text box) Embed: URL: Thumbnail: WordPress Embed Customize Embed The presentation is successfully added In Your Favorites. Views: 316 Category: Education License: All Rights Reserved Like it (0) Dislike it (0) Added: February 13, 2008 This Presentation is Public Favorites: 0 Presentation Description No description available. Comments Posting comment... Premium member Presentation Transcript Open Discussion of Design Flow: Open Discussion of Design Flow Today’s task: Design an ASIC that will drive a TV cell phone Exercise objective: Importance of codesignLayout Styles: Layout Styles Full-custom Gate-array Standard-cell Macro-cell FPGA (Field Programmable Gate-Array)Full-custom: Full-custom Complete control over transistor and interconnect dimensions (within design rule constraints) Produces Optimized Design (density, power, performance) Circuit Designers create application-specific building blocks Technology Provider (foundry) provide SPICE/HSPICE transistor models, parasitic extraction tools Models are used to drive transistor sizing/layout constraints Layout technician creates graphics from design schematic Top level down/Bottom level up Continual verification of design as it becomes more definedDesign Rule Constraints: Design Rule Constraints Minimum Spacing Between metal lines (varies per layer) Line width Transistor channel lengths Active area Via stacks (Check from work) Full-custom Disadvantages: Full-custom Disadvantages Most time-consuming Most error-prone Highest NRE (non-recurring expense) Design time Layout time Mask costs Longest time to manufactureGate-array Layout: Gate-array Layout Transistors pre-placed, fixed in size Personalized by metal routing Fastest to manufacture Lowest mask cost Lends itself to automated placement and wiring Gate Array: Gate Array Vdd Gnd Horizontal Routing Channel Vertical Routing Channel Sea of Gates: Routing Channels removed, route at higher metal layersGate Array Example: Gate Array Example Vdd Gnd A A B B Vdd Vdd Schematic A A B B Out Out Gate-array Disadvantages: Gate-array Disadvantages Non-optimized spacing Limited transistor sizing options Density Performance Power Wiring blockages/inefficiencies Excess circuitryStandard Cell Layout: Standard Cell Layout Design partitioned into cells of standard height Power and Ground (Power grid) wiring preset Technology provider supplies libraries of pre-designed cell elements for usage (utilize varying numbers of cells) Primitives (NAND, NOR, etc.) Storage Elements (DFF) Libraries can be tailored to specific applications (e.g., low power vs. high performance) Requires full manufacturing sequence Typically automated place and wiringStandard Cell Layout: Standard Cell Layout Routing Channel Routing Channel Feed-through cell Note uniform heightOur Cell Library: Our Cell Library Need specifics on library students will be usingStandard Cell Disadvantages: Standard Cell Disadvantages Cell height restrictions limits cell library contents Full set of masks Longer manufacturing timesMacro-cell Layout: Macro-cell Layout Library elements provided by technology supplier (e.g., foundry) Elements can be of varying heights and widths Richer variety of library elements (IP friendly) Macro-cell Disadvantages: Macro-cell Disadvantages Similar to Standard-cell in length of manufacturing times, mask costs Placement and wiring more complex Pre-layout of power grid more difficult, may not be possibleFPGA: FPGA Field Programmable Gate Array Array of logic blocks (Configurable Logic Blocks CLB) Switchable interconnect resources Wire segments of varying lengths Programmable switches that connect logic resources to wire segments Final user sets switches (CLB and interconnect) Immediate Use (“zero” fab time) Minimal expense Great for hardware prototypingSlide17: FPGA: Virtex-II Architecture Virtex™-II architecture’s core voltage operates at 1.5V I/O Blocks (IOBs) Configurable Logic Blocks (CLBs) Clock Management (DCMs, BUFGMUXes) Block SelectRAM™ resource Dedicated multipliers Programmable interconnect © 2005 Xilinx, Inc. All Rights Reserved For Academic Use OnlySlices and CLBs: Slices and CLBs Each Virtex-II CLB contains four slices Local routing provides feedback between slices in the same CLB, and it provides routing to neighboring CLBs A switch matrix provides access to general routing resources CIN COUT COUT Local Routing CIN SHIFT © 2005 Xilinx, Inc. All Rights Reserved For Academic Use OnlySimplified Slice Structure: Slice 0 D Q CE PRE CLR D Q CE PRE CLR Simplified Slice Structure Each slice has four outputs Two registered outputs, two non-registered outputs Two BUFTs associated with each CLB, accessible by all 16 CLB outputs Carry logic runs vertically, up only Two independent carry chains per CLB © 2005 Xilinx, Inc. All Rights Reserved For Academic Use OnlyFPGA Disadvantages: FPGA Disadvantages Least efficient use of silicon/wiring resources Limited size options Limited performance Not good for high volume applications If used for prototyping, still may have significant changes when migrate to higher performance design and package solution