Presentation Transcript
SIU Manufacturing Readiness Review (MRR) : GLAST Large Area Telescope:
G. Haller
SLAC
haller@slac.stanford.edu
(650) 926-4257
SIU Manufacturing Readiness Review (MRR)
Contents : Contents Overview (G. Haller)
SIU Module Description
Changes since CDR
Design and Test Documentation
Engineering Module Validation
Production
Quality Assurance Quality Assurance Plan
LAT Electronics : LAT Electronics 3 Event-Processor Units (EPU) (2 + 1 spare)
Event processing CPU
LAT Communication Board
SIB Spacecraft Interface Units (SIU)*
Storage Interface Board (SIB): Spacecraft interface, control & telemetry
LAT control CPU
LAT Communication Board (LCB): LAT command and data interface 16 Tower Electronics Modules & Tower Power Supplies * Primary & Secondary Units shown in one chassis Power-Distribution Unit (PDU)*
Spacecraft interface, power
LAT power distribution
LAT health monitoring Global-Trigger/ACD-EM/Signal-Distribution Unit* TKR CAL TKR Front-End Electronics (MCM) ACD Front-End Electronics (FREE) CAL Front-End Electronics (AFEE)
SIU/EPU Mounted on LAT : SIU/EPU Mounted on LAT SIU PDU EPU’s
SIU/EPU Crate Electronics : SIU/EPU Crate Electronics Storage Interface Board (SIB)
EEPROM
MIL1553 Communication with spacecraft*
Power Control of PDU/GASU power switches in PDU*
Power Control of VCHP switches in heater box*
LAT Communication Board (LCB)
Communication with GASU
Commanding
Read-back Data
Housekeeping Data
Event Data
Crate Power Supply Board (CPS)
28V to 3.3V/5V conversion
Power-On Reset
LVDS-CMOS conversion of spacecraft discretes*
System clock to GASU
CPU Board (RAD750)
Processor**
IO of level-converted SC discretes
Crate Backplane (CBP)
passive *Only used in SIU crate
**Start-up ROM code different from EPU and SIU
SIU/EPU Crate : SIU/EPU Crate Partially loaded crate on left (without LCB and SIB)
Fully loaded crate on right
Shown are also serial card and ethernet cards, not part of flight assembly (cards with front-panel connections)
CBP & CPS & CPU : CBP & CPS & CPU CPS (Crate Power Supply Board) CBP (Crate Backplane) CPU (RAD750 from BAE)
SIB & LCB : SIB & LCB SIB (Storage Interface Board) LCB (LAT Communication Board)
Changes since CDR : Changes since CDR
SIB/LCB
Code in FPGA was finished/modified and bugs fixed
Some resistor values were changed to optimize performance
CPS
Some resistor/capacitor values were changed to optimize performance
Backplane
Some interconnections were added between modules and connector IO
Power Peer Review RFA Status : Power Peer Review RFA Status RFA 3
Request
Need to get AR-461 filter schematic plus schematic of 28-28 supply on spacecraft. Need to develop model of power and ground distribution to verifiy filter performance relative to 100 kHz noise. Damping of the entire filter network should also be verified to assure that an interactive among the many identical filters cannot occur.
Response (SLAC)
The PRU Road Show exercised the Spacecraft PRU and the LAT interface and tested the performance. The results are:
(1) The interface between the Spacecraft and LAT is understood (pinouts and signal definitions) .
(2) The SIU, VCHP and DAQ feeds are stable under full load.
(3) The conducted EMI is within the requirement.
(4) The Calorimeter - Tracker mini-tower performs properly with the spacecraft PRU.
(5) There were no significant transients when the LAT feed is turned off when fully powered .
The test results are documented in LAT-AM-04670.
Power Peer Review RFA Status (Continued) : Power Peer Review RFA Status (Continued) RFA 4
Request
T0-220 Maxim regulators have their mounting tabs connected to ground. This has the potential of creating an undesirable ground path with associated noise problems. The optimum grounding solution for this particular configuration is to connect all elements to chassis and use the structure as the primary ground return (as diagrammed on the conference room whiteboard). It is strongly recommended that this approach be taken to assure proper instrument performance despite the fact that the approach is slightly unorthodox. As a second issue, it is also suggested that gold foil or indium foil be used to assure reproducible heat sink contact for the regulators. The grease or no intermediate material approaches are strongly recommended against.
Response (SLAC)
1) The grounding approach defined in the RFA is the current implementation. The grounding tabs on the Maxim regulators are mounted directly to the enclosure, and the enclosure used as the primary ground return
(2) The regulators are mounted using a thermally conductive adhesive (CV-2946 Nusil). Tests on the EM hardware showed minimal temperature rise (a few degrees) across the interface.
Power Peer Review RFA Status (Continued) : Power Peer Review RFA Status (Continued) RFA 5
Request
Maxim part screening must be carefully done to assure that the testing provides valid verification reliability. Documented methods by Maxim are for static burn-in only (diffusion based issues) and do not represent the actual operational case planned for GLAST. In that the GLAST application is actually fairly stressful AND uses the part outside of its normal operational range (for the 1.5 volt output case), it is suggested that the screening and qual test be configured to verify the 1.5 volt configuration since it is most stressful. Note that great care must be taken with the layout and instrumentation to assure that the setup does not accidentally result in part damage.
Response (NASA/SLAC)
Parts were screened and qualification testing performed at GSFC.
Power Peer Review RFA Status (Continued) : Power Peer Review RFA Status (Continued) RFA 6
Request
The 28 volt converter planned for use by Spectrum Astro, uses a step-up transformer. A quick calculation indicates that the step-up ratio is probably 1.5 or more. therefore, a failure where the control loop goes open while the bus is at 33 volts, could put as much as 50 volts on the input to the power supply regulators. Such a condition could have catastrophic consequences to the instrument such that system level redundancy could be compromised due to progagation of the failure across interfaces. Therefore, it is strongly recommended that overvoltage protection be implemented to assure protection of the hardware plus protection against failure propagation.
Response (NASA)
Lambda identified a credible single point failure that could cause an overvoltage condition. Spectrum added a transorb across the output of each 28 volt feed to prevent the voltage from exceeding 38 V. A test was run at Lambda at the end of August to verify the design. The preliminary results show that the voltage never exceeded 38 V. Spectrum Astro is reviewing the test results and performing additional studies to ensure the test results are analytically consistent with the circuitry.
ELX Peer Review RFA Status : ELX Peer Review RFA Status RFA 23
Request
In order to understand EMI, perform SPICE analysis of the LAT internal power distribution bus. Include models for S/C DC/DC converters, all filters, and LAT DC/DC converters. Use model to establish EMI self-compatibility, i.e. will the internal EMI sources cause problems. Look at inrush issues as well
Response
We are not able to perform SPICE level simulations due to the lack of SPICE models for the converter hybrids. However no issues were found in tests performed (PRU road-show and test-bed). EMI will be tested on the qualification models.
ELX Peer Review RFA Status (Continued) : ELX Peer Review RFA Status (Continued) RFA 24
Request
For the CDR, revise the grounding scheme chart to make it more clear and accurate.
Response
Was done for CDR
SIU/EPU Documents (all released) : SIU/EPU Documents (all released) SIB
LAT-DS-01674-56 Circuit Card Assembly SIU-SIB
LAT-DS-02871-51 PWB, Fab, Loading, and Assembly-SIU-SIB
LAT-TD-02585-54 Excel Bill of Materials SIU-SIB
LAT-DS-01675-51 Printed-Wiring Board SIB
LAT-DS-02141-51 6u-Front-Panel
LAT-DS-02403-50 Heat-Sink Stiffener
LAT-DS-01676-51 Storage Interface Board Schematic
LCB
LAT-DS-01679-56 Circuit Card Assembly
LAT-DS-01680-51 Printed-Wiring Board LCB
LAT-DS-02872-51 PWB, Fab, Loading, and Assembly
LAT-TD-02584-53 Bill of Materials
LAT-DS-02141-51 6u-Front-Panel
LAT-DS-02403-50 Heat-Sink Stiffener
LAT-DS-01681-54 LCB Schematic
CPS
LAT-DS-01669-56 Circuit Card Assembly
LAT-DS-01670-53 Printed-Wiring Board CPS
LAT-DS-02870-53 PWB, Fab, Loading, and Assembly
LAT-TD-02356-54 Bill of Materials
LAT-DS-02140-51 3u-Front-Panel
LAT-DS-02401-50 Heat-Sink
LAT-DS-01702-54 Crate Power Supply Schematic
CBP
LAT-DS-01662-52 Circuit Card Assembly
LAT-DS-01663-52 Printed-Wiring Board CPB 4-25-05
LAT-DS-02869-52 PWB, Fab, Loading, and Assembly
LAT-TD-02586-50 Bill of Materials in excel
LAT-DS-02964-56 Assembly: CBP, cable and connector plate
LAT-DS-02117-50 Connector Plate, SIU/EPU Chassis
SIU/EPU Assembly
LAT-DS-01862-52 SIU/EPU Assembly
Engineering Model Design Validation : Engineering Model Design Validation
Tested on bench and on test-bed
Functionality and performance validated on test-bed
16 TEM/TPS, EM PDU and GASU connected to SIU & EPU’s
Validated over frequency and voltage margins
Limitations
Only limited temperature tests performed on SIU
Parts, Materials, and Processes : Parts, Materials, and Processes All EEE Parts approved by the Program Parts Board
Materials
All Materials have been approved by the Program MPRB in accordance with LAT-SS-00107, LAT Mechanical Parts Plan
GLAST/LAT Material Usage Agreement #002 (MAR DID No. 313; LAT Document # LAT-TD-04756-01)- Approved 9/13/04
Processes
All processes have been reviewed and approved by the Program MPRB in accordance with LAT-SS-00107, LAT Mechanical Parts Plan
Procurement Status : Procurement Status All parts were procured and received
FPGA’s were programmed
Contract for assembly was awarded
Manufacturing Process Flow at assembler, Configuration Management, identical to what was presented for the PDU & GASU, see
http://www-glast.slac.stanford.edu/Elec_DAQ/Reviews/GASU-MRR/reviews.htm
Quality Assurance : Quality Assurance Same vendor and processes as used for PDu and GASU modules
See QA presentation at
http://www-glast.slac.stanford.edu/Elec_DAQ/Reviews/GASU-MRR/reviews.htm
Catch the
buzz on authorSTREAM
Copyright © 2002-2008 authorSTREAM. All rights reserved.