IPC SPVC K Yasuda

JWES Activities & Areas of Cooperation: 

JWES Activities & Areas of Cooperation JWES Soft solder research committee Osaka University Kiyokazu YASUDA

Contents: 

Contents 1. Introduction of JWES 2. Lead-free Solder Project in Japan 3. Standardization of Test Methods 4. Round Robin Tests on 4.1 Melting temperature range 4.2 Mechanical property 5. Summary

1. Introduction JWES: 

1. Introduction JWES

JWES: 

THE JAPAN WELDING ENGINEERING SOCIETY(JWES) 　　　　　　　　　　　 　 http://www.jwes.or.jp/ 1.  Establishment of the Japan Welding Engineering Society 2.  Activities of the JWES (1)  Research Activities by Divisions and Research Committees (2)  Standardization (3) Education (4)  Quality Assurance Activities by Accreditation and Certification (5) International Qualification (6)  Japan Welding Contest (7)  International Cooperation (8) Welding　Show 3.  Organization Board members:  29          Auditors:  3          Councilors:  110 Corporate members:  141 organizations          Individual members:  303 JWES

Member of JWES Soft Solder Research Committee (Suppliers): 

Member of JWES Soft Solder Research Committee (Suppliers) Aoki Metal Harima Ishikawa Koki Tech Kojima Handa Nihon Almit Nihon Genma Nihon Superior Nippon Filler Metals Matsuo Handa Senju Metal industry Solder Coat Tarutin Kester Tamura Kaken Uchihashi Estec Mitsui Kinzoku

Member of JWES Soft Solder Research Committee (Users): 

IBM Japan Sanyo Oki Sony Panasonic NEC Toshiba Hitachi Mitsubishi Toyota Nissan Denso Calsonic Member of JWES Soft Solder Research Committee (Users) Automobile Electronics

Member of JWES Soft Solder Research Committee (Neutral body): 

Member of JWES Soft Solder Research Committee (Neutral body) Tokyo

2. Lead-Free Solder Project in Japan: 

2. Lead-Free Solder Project in Japan

Relations - JWES & JEITA -: 

Relations - JWES & JEITA - ORGANIZATIONS ・Japan Welding Engineering Society (JWES) ・Japan Electronics and Information Technology 　 Industries Association (JEITA) OBJECTIVE ・JWES Basic study on lead free solders and related materials for standardization WG member of ISO & IEC for standardizing Pb free solder alloys ・JEITA (JEIDA) Application and test methods for evaluation of components

Slide10: 

Lead-free Solder Projects in Japan Projects in JWES Entrusted by NEDO (New Energy and Industrial Technology Development Organization in Japan) 1. Research and development of lead free solders for standardization (1999.1-2000.3) 2. Standardization of test methods necessary for lead free soldering (2001.1-2002.3) ・Project Chair: Prof . T. TAKEMOTO (Osaka Univ.) ・Members: Major Assembly Companies Major Component Companies Major Solder and Flux Companies Universities and Institutes

Slide11: 

CONTENTS of OUTPUTS as JIS Z 3198, “Test methods for lead-free solders, Part 1-Part 7” Seven test methods for lead-free solders and lead-free solder joints have been issued on June 2003. 1. Methods for measuring melting temperature ranges Many lead-free solders have melting temperature ranges. Difficult to determine liquidus and solidus of non-eutectic alloys. 2. Methods for testing mechanical characteristics Mechanical strength, elongation etc. of lead free solders. Standardization of Test Methods Necessary for Pb-free Solders and Pb-free Solder Joints ---JWES STS Commission--- (2001.1-2002.3)

Slide12: 

3. Methods for spread test 4. Methods for solderability test by a wetting balance method and a contact angle method. Wettability of lead free solders 5. Methods for tensile strength tests and shear tests on lead-free solder joints. Mechanical strength, elongation etc. of lead free solders 6. Methods for 45o pull test of solder joints on QFP lead with lead free solders. 7. Methods for shear strength of solder joints on chip components with lead free solders.

Round Robin Tests on Melting Temperature Range and Tensile Strength of Lead-free Solders 2003-2004: 

Round Robin Tests on Melting Temperature Range and Tensile Strength of Lead-free Solders 2003-2004 Test Samples: 22 Lead-free solders listed for ISO, IEC and JIS ・ Sn-Sb, Sn-Cu ・Sn-Ag, Sn-Ag-Cu ・Sn-Ag-In-Bi ・Sn-Zn, Sn-Zn-Bi ・Sn-Bi, Sn-Bi-Ag, and more… Organized by Solder Research Committee, JWES ・Solder Companies, Universities and Public Institute Symposium on Test Results held on Oct. 6, 2004 Test Results are available as CD-R

3. Standardization of Test Methods: 

3. Standardization of Test Methods

IEC’s Action for Lead-free Standardization: 

IEC’s Action for Lead-free Standardization

ISO’s Action for Lead-free Standardization: 

ISO’s Action for Lead-free Standardization

Outline of the Draft of IEC and ISO Lead-free Standards: 

Outline of the Draft of IEC and ISO Lead-free Standards 1. Definition of lead free solder and other impurities’ level Pb =<0.10% 2. Lead free candidates (see next page table) About 20 candidates are selected based on IEC 61190-1-3 (2000), ISO-9453(1990) ,IPC J-STD-006(1995); plus other available lead free solder alloys which are already used widely, and/or have a strong possibility to be used. ISO sent a letter to the patent holders asking if they agree to list those patented alloys in the standards with RAND(reasonable and non-discriminatory).

Lead-free Candidates Table-IEC 61190-1-3-rev.2004: 

Lead-free Candidates Table-IEC 61190-1-3-rev.2004

Summary : 

Summary Two international standards, IEC and ISO, will have compatible lead free standards through WEEE & RoHS legislation (July,1st,2006). Lead free definition, Pb=<0.10%, agreed upon by IEC and ISO lead free standardization working groups. Some editorial and/or technical issues are going to be resolved by 2005. For example: ISO9453: Alloy number for lead free solders IEC61190-1-3: Editorial and/or technical issues Regarding lead free solder paste standard (IEC 61190-1-2), there are little revision points from existing one. “Lead free Labeling” standard will be discussed and issued by IEC TC91 WG1.