GA MRR 111804

Slide1: 

GLAST LAT Tracker Delta Manufacturer Readiness Review for Tray Assembly and Test at G&A Luca Latronico INFN-Pisa luca.latronico@pi.infn.it

Relevant Documents: 

Relevant Documents LAT-PS-01801 Integration of TMCM and SSD Ladders onto Tracker Trays released – MRB on wire-bonds encapsulation removal requires sigantures approval LAT-PS-03534 Single Tray Electrical Test Plan released Production company: G&A Engineering, Carsoli-Oricola (AQ)

Assembly and test flow-chart: 

Assembly and test flow-chart INFN provides G&A with tray panels, TMCMs, ladders, (and their relative locations on the tray) + Nusil adhesives Alignment jig (WS-B1) provides: TMCM planarity Pitch adapter planarity Bonding pads alignment (HV and shield pads) Dry assembly test to check TMCM connectors clearance Adhesive distribution (WS-B2) Assembly of TMCM onto tray (WS-B3) Metrology (WS-B4) Wire bonding (WS-B5) Electrical tests (WS-B6) Current production rate ramping up: need to match CC pocket and MCM connector depth extra screening on TMCM pitch adapter (missing connections on signal strips and HV lines – PA debondings) WS-A Material receiving and inspection WS-B TMCM Integration

Assembly and test flow-chart: 

Assembly and test flow-chart Ladder test (WS-C1) Tray Z positioning under CMM (WS-C2) 50m wrt nominal position Ladder positioning on the bridges (WS-C3) Alignment from bridge itself used as reference and excellent alignment of SSD inside ladder (~2 mm RMS) Glue deposition (WS-C4) 19 spots of siliconic glue/SSD 4 spots conductive glue + 1 unbroken line across ladders Ladder assembly (WS-C5) Ladder metrology (WS-C6) Ladder height 0.250.1 mm Ladders relative parallelism of 0.1 mm Wire bonding (WS-C6) Destructive pull tests on coupons (>5g each) Visual inspection Functional test by INFN with tray inside box LAT-PS-03534 DRB and shipping to INFN WS-C Ladders integration WS-D Final disposition

Availability of components and tools: 

Availability of components and tools Bare panel trays after TVAC test in Roma2 27 trays available – planned supply is 4trays/day SSD Ladders from G&A and Mipot ~1400 ladders available - 400 more from G&A (200 to test, 200 being built) – 900 will be built from Mipot asap MCM from SLAC through quick functional verification at INFN-Pisa Currently 38+32 Could match 14 trays (26 TMCMs) from first lot of 38 because of connector stick-out issue 6 TMCMs sent back to SLAC for PA debondings Nusil at G&A for ~3/4 of tray production G&A tools TMCM alignment tools: 5 Ladder integration tools (tray alignment + ladder bridges): 6 CMM: 2 (1 for alignments, 1 for metrology) Glue dispenser: 2 wire-bonder: 2 2 working shifts per day to grant production rate of 4 trays/day EGSE for functional tests 1 full EGSE system installed at G&A and operated by INFN

Data exchange with INFN-Pisa: 

From INFN to GA: List of subparts (ladders and TMCM) from INFN-Pisa From GA to INFN: List of subparts with G&A reference SNs (neede for tray box) Progress of assembly (weekly) Quality Assurance Rely on G&A certified QA program for internal activity Handle major NCR notified from G&A (MARECO) with Pisa system Data exchange with INFN-Pisa

Tower 0 tray production: 

Tower 0 tray production 14 complete trays assembled (27 TMCMs and SSD Ladder planes) 23 Si layers were within specs 4 Si layers had short for problems related to bias circuit delamination All went through thermal tests 4 Si layers (bottom side of heavy trays) had many disconnected channels because of CTE mismatch impact on wire-bond encapsulation  MRB on wire-bond encapsulation 23 SSD layers operated successfully up to now

Metrology of ladders alignment: 

Metrology: with a CMM with interchangeable mechanical-optical heads, the positions of 12 “C” markers, 3 for each ladders, and the positions of the MCM alignment pins are measured on both sides of the tray. Metrology of ladders alignment

Results – ladders alignment: 

Results – ladders alignment

Functional test results – leakge current: 

079MID front: 1.67 uA @ 150 V 079MID back: 1.85 uA @ 150 V 050MID front: 2.02 uA @ 150 V 050MID back: 1.77 uA @ 150 V Functional test results – leakge current

Functional test results – trigger rates vs threshold: 

050MID front 050MID back 079MID back 079MID front Functional test results – trigger rates vs threshold

Functional tests results – bad channels: 

Functional tests results – bad channels Total number of bad channels well within specs (16 max) High reliability of PA screening test on TMCM High yield of wire-bonding

Conclusions: 

Conclusions Assembly and test procedures well tuned and tested on EM trays and tower 0 G&A moving rapidly to planned production rate High yield of assembly so far > 100 ladders glued and wire-bonded with no failures and well within specs Tower A production well within specs Leakage current Noise and thresholds performance Bad channels