China RoHS:
China RoHS China RoHS: China promulgated the ‘Management Methods for the Control of Pollution from Electronic Information Products’ in early 2006
This law requires companies to identify and verify the concentration of ‘hazardous substances’ in ‘electronic information products’ sold within China
Hazardous substances are defined as the six EU RoHS substances (lead, mercury, hexavalent chromium, cadmium, PBBE and PBDE)
Phase 1 governs identification of hazardous substances
Effective March 1, 2007
Phase 2 governs verification of hazardous substances
No date has been set as of early 2007 for Phase 2
China RoHS Phase 1:
China RoHS Phase 1 Applicability to Xilinx:
Based on definitions and the scope of China RoHS, all Xilinx integrated circuits (i.e., FPGA, CPLD, etc.) are ‘electronic information products’ and will be affected beginning March 1, 2007
China RoHS Phase 1:
China RoHS Phase 1 Product Marking: Article 4 of the Marking Standard SJ/T11364-2006 states:
‘With respect to the electronic information products that are purchased for manufacturing. Suppliers need not provide the aforementioned marking, but shall supply to the purchaser all necessary information required for marking.’
As such, Xilinx components will NOT be marked
Disclosure:
Disclosure Information Disclosure: Detailed material declarations are currently available online
http://www.xilinx.com/system_resources/lead_free/index.htm
Xilinx Components:
Xilinx Components Disclosure Tables: Xilinx has also developed China RoHS compliant disclosure tables for electronic information products that have lead above the maximum concentration limits established in SJ/T11365-2006
At Xilinx, this only applies to:
Standard Integrated Circuits
BGA Flip Chips that are EU Compliant by Exemption (Package Codes FFG and BFG)
Additional information is available upon request at spec_control@xilinx.com