Wireless Workshop Tyndall

Slide1: 

Tyndall National Institute Ireland’s Centre for ICT Research Ambient Electronic Systems Research at The Tyndall National Institute

Slide2: 

Ambient Electronics “Ubiquitous computing is roughly the opposite of virtual reality. Where virtual reality puts people inside a computer-generated world, ubiquitous computing forces the computer to live out here in the world with people.”. Mark Weiser .

Slide3: 

25mm, 10mm, 1mm Family

25mm: 

25mm Wearable Computers – Human Computer Interface Ambient Embedded Intelligence – E-Gadgets E-Graculture – Solar Powered Environmental Sensing/Actuation Before After

10mm: 

10mm Multilayer Flex Assembly for 1 cm cube Challenges: Increasing Flex Pattern Resolution Attaining Functionality for 1 cm Cube Approach: Multilayer Flex Assembly and Folding Solder (Die and Package) Bonding Laser Drilling of Flex for Vias 70m pattern resolution

5mm: 

5mm Challenges: Techniques for Release of Thin Flex Rigidising Effect of Multiple Layers Approach: Spin on Polyimide (3 m / layer). Sequential Build Up. Flex Release 3 m at NMRC (without Adhesion Promoter) NMRC 3 Die Stack with 15 m Flex Fold Radius defined to minimise stress. R= f(Die Thickness, Flex Thickness) Need New Techniques to Reduce Form Factor of Multiple Layers of Flex

Slide7: 

This proof of concept module demonstrates the capability to provide interconnection solutions for 1mm functional intelligent seed (I-Seed). 1mm cube module (a) Patterning all six sides of the five layer stacked Si dies using focused Ion Beam (FIB); (b) FIB image showing edge after pattering with platinum where platinum also deposited on the edge; (c) Daisy chain structures. Highly miniaturised 3D integration of functional bare die devices is a key target in achieving the I-Seed. ~ 1mm Microsystem

Slide8: 

Application Areas

Slide9: 

AES roadmap developing State of the Art Miniaturised Wireless Sensor Systems Wireless Sensor Networks About – On – Within the Person and community Micro & Nano Technologies can provide Enabling Technology Platforms in different Application Areas National Access Plan (NAP) Access to Tyndall Resources for Collaborative Research Key Competency Requirements Sensor Development, Software Development Research Collaborators Research Institutes (NCSR, CiT, UL, UCC), SMEs (Innovada, Cratlon, CEL), Multinationals (Intel, Analog). Etc. etc. Conclusions